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TL431QDBZR,215

NXP TL431QDBZR,215

散装在售

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NXP USA Inc.
TL431QDBZR,215
IC VREF SHUNT PREC ADJ SOT-23-3
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¥0.54

价格更新:一个月前

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产品详情

Overview

The TL431QDBZR is IC VREF SHUNT ADJ SOT23-3, that includes TL431 Series, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.050717 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in TO-236-3, SC-59, SOT-23-3, it has an Operating Temperature range of -40°C ~ 125°C (TA), the device can also be used as Surface Mount Mounting Type. In addition, the Output Type is Adjustable, the device is offered in SOT-23-3 Supplier Device Package, the device has a ±2.2% of Tolerance, and Current Output is 100mA, and the Reference Type is Shunt, and Voltage Output Min Fixed is 2.495V, and the Voltage Output Max is 36V, and Temperature Coefficient is 34 PPM / C, and the Current Cathode is 1mA, it has an Maximum Operating Temperature range of + 125 C, it has an Minimum Operating Temperature range of - 40 C, and Output Voltage is Adjustable, and the Initial Accuracy is 2 %, and Series VREF Input Voltage Max is 37 V, and the Shunt Current Max is 100 mA, and Maximum Output Voltage is 36 V, and the Shunt Current Min is 600 uA.

The TL431QDBVTG4 is IC VREF SHUNT ADJ SOT23-5, that includes Tape & Reel (TR) Alternate Packaging Packaging, they are designed to operate with a Surface Mount Mounting Type, Supplier Device Package is shown on datasheet note for use in a SOT-23-5, that offers Reference Type features such as Shunt, Package Case is designed to work in SC-74A, SOT-753, as well as the Adjustable Output Type, it has an Operating Temperature range of -40°C ~ 125°C (TA). In addition, the Voltage Output Max is 36V, the device is offered in 2.495V Voltage Output Min Fixed, the device has a 1mA of Current Cathode, and Current Output is 100mA, and the Tolerance is ±2.2%.

Features

Bulk Package
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包装: 散装
部件状态: 在售
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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