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SPC5673FK0MVR2

NXP SPC5673FK0MVR2

e200z7200MHz3MB(3M x 8)

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NXP USA Inc.
SPC5673FK0MVR2
IC MCU 32BIT 3MB FLASH 416PBGA
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¥1365.00

价格更新:一个月前

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产品详情

Overview

The SPC5673FF3MVY2 is IC MCU 32BIT 3MB FLASH 516FPBGA, that includes MPC56xx Qorivva Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 516-BBGA, it has an Operating Temperature range of -40°C ~ 125°C (TA), Supplier Device Package is designed to work in 516-FPBGA (27x27), as well as the 32 Number of I O, the device can also be used as 200MHz Speed. In addition, the Core Processor is e200z7, the device is offered in 192K x 8 RAM Size, the device has a FLASH of Program Memory Type, and Peripherals is DMA, POR, PWM, and the Connectivity is CAN, EBI/EMI, SCI, SPI, and Voltage Supply Vcc Vdd is 1.08 V ~ 1.32 V, and the Core Size is 32-Bit, and Program Memory Size is 3MB (3M x 8), and the Data Converters is A/D 64x12b, and Oscillator Type is External.

The SPC5673FF3MVV2 is "32-bit Microcontrollers - MCU 3M FLASH manufactured by NXP / Freescale. The SPC5673FF3MVV2 is available in PBGA-516 Package, is part of the Embedded - Microcontrollers, , and with support for "32-bit Microcontrollers - MCU 3M FLASH, 32-bit Microcontrollers - MCU 3M FLASH, 192K RAM.

Features

MPC56xx Qorivva Series
416-BBGA package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
SPC5673FK0MVR2 Microcontroller applications.

  • Automatic control
  • Equipment control
  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
产品属性
全选
型号系列: MPC56xx Qorivva
包装: 托盘
部件状态: 在售
可编程: 未验证
核心处理器: e200z7
内核规格: 32 位单核
速度: 200MHz
连接能力: CANbus,SCI,SPI
外设: DMA,POR,PWM
输入/输出数量: 32
程序存储容量: 3MB(3M x 8)
程序存储器类型: 闪存
RAM 大小: 192K x 8
电源电压(Vcc/Vdd): 1.08V ~ 5.25V
数据转换器: A/D 64x12b
振荡器类型: 外部
工作温度: -40°C ~ 125°C(TA)
安装类型: 表面贴装型
封装/外壳: 416-BBGA
供应商器件封装: 416-PBGA(27x27)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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