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SPC5516GBMLQ66

NXP SPC5516GBMLQ66

e200z0,e200z166MHz1MB(1M x 8)

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NXP USA Inc.
SPC5516GBMLQ66
IC MCU 32BIT 1MB FLASH 144LQFP
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产品详情

Overview

The SPC5516EBMLQ66 is IC MCU 32BIT 1MB FLASH 144LQFP, that includes MPC55xx Qorivva Series, they are designed to operate with a Tray Packaging, Unit Weight is shown on datasheet note for use in a 0.046530 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 144-LQFP, it has an Operating Temperature range of -40°C ~ 125°C (TA), the device can also be used as 144-LQFP (20x20) Supplier Device Package. In addition, the Number of I O is 111, the device is offered in 66MHz Speed, the device has a e200z0, e200z1 of Core Processor, and RAM Size is 64K x 8, and the Program Memory Type is FLASH, and Peripherals is DMA, POR, PWM, WDT, and the Connectivity is CAN, EBI/EMI, I2C, SCI, SPI, and Voltage Supply Vcc Vdd is 4.5 V ~ 5.25 V, and the Core Size is 32-Bit Dual-Core, and Program Memory Size is 1MB (1M x 8), and the Data Converters is A/D 40x12b, and Oscillator Type is Internal, it has an Maximum Operating Temperature range of + 125 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 3.3 V 5 V, and Interface Type is CAN I2C SCI SPI, and the Core is e200z1, and Processor Series is MPC5xxx, and the Data Bus Width is 32 bit, and Maximum Clock Frequency is 16 MHz, and the Number of ADC Channels is 40, and Data RAM Size is 80 kB, and the Number of Timers Counters is 8 Timer, and ADC Resolution is 12 bit, and the Data RAM Type is RAM.

The SPC5516EAMMG66 is IC MCU 32BIT 1MB FLASH 208MAPBGA, that includes CAN, EBI/EMI, I2C, SCI, SPI Connectivity, they are designed to operate with a Core Processor, Core Size is shown on datasheet note for use in a 32-Bit Dual-Core, that offers Data Converters features such as A/D 40x12b, Number of I O is designed to work in 144, it has an Operating Temperature range of -40°C ~ 125°C (TA), the device can also be used as Internal Oscillator Type. In addition, the Package Case is 208-BGA, the device is offered in Tray Packaging, the device has a DMA, POR, PWM, WDT of Peripherals, and Program Memory Size is 1MB (1M x 8), and the Program Memory Type is FLASH, and RAM Size is 64K x 8, and the Series is MPC55xx Qorivva, and Speed is 66MHz, and the Supplier Device Package is 208-MAPBGA (17x17), and Voltage Supply Vcc Vdd is 4.5 V ~ 5.25 V.

Features

MPC55xx Qorivva Series
144-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
SPC5516GBMLQ66 Microcontroller applications.

  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
产品属性
全选
型号系列: MPC55xx Qorivva
包装: 托盘
部件状态: 停产
可编程: 未验证
核心处理器: e200z0,e200z1
内核规格: 32 位双核
速度: 66MHz
连接能力: CANbus,EBI/EMI,I²C,SCI,SPI
外设: DMA,POR,PWM,WDT
输入/输出数量: 111
程序存储容量: 1MB(1M x 8)
程序存储器类型: 闪存
RAM 大小: 64K x 8
电源电压(Vcc/Vdd): 4.5V ~ 5.25V
数据转换器: A/D 40x12b
振荡器类型: 内部
工作温度: -40°C ~ 125°C(TA)
安装类型: 表面贴装型
封装/外壳: 144-LQFP
供应商器件封装: 144-LQFP(20x20)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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