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SPC5514GBMLQ66

NXP SPC5514GBMLQ66

e200z0,e200z166MHz512KB(512K x 8)

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NXP USA Inc.
SPC5514GBMLQ66
IC MCU 32BIT 512KB FLASH 144LQFP
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产品详情

Overview

The SPC5514EBMLQ66 is IC MCU 32BIT 512KB FLASH 144LQFP, that includes MPC55xx Qorivva Series, they are designed to operate with a Tray Packaging, Unit Weight is shown on datasheet note for use in a 0.046530 oz, that offers Package Case features such as 144-LQFP, it has an Operating Temperature range of -40°C ~ 125°C (TA), as well as the 144-LQFP (20x20) Supplier Device Package, the device can also be used as 111 Number of I O. In addition, the Speed is 66MHz, the device is offered in e200z0, e200z1 Core Processor, the device has a 32K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is DMA, POR, PWM, WDT, and Connectivity is CAN, EBI/EMI, I2C, SCI, SPI, and the Voltage Supply Vcc Vdd is 4.5 V ~ 5.25 V, and Core Size is 32-Bit Dual-Core, and the Program Memory Size is 512KB (512K x 8), and Data Converters is A/D 40x12b, and the Oscillator Type is Internal, and Core is e200z1, and the Processor Series is MPC5xxx, and Data Bus Width is 32 bit.

SPC5502DMLL4 with circuit diagram manufactured by Freescale. The SPC5502DMLL4 is available in TQFP100 Package, is part of the IC Chips.

Features

MPC55xx Qorivva Series
144-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
SPC5514GBMLQ66 Microcontroller applications.

  • Automatic control
  • Equipment control
  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
产品属性
全选
型号系列: MPC55xx Qorivva
包装: 散装
部件状态: 在售
可编程: 未验证
核心处理器: e200z0,e200z1
内核规格: 32 位双核
速度: 66MHz
连接能力: CANbus,EBI/EMI,I²C,SCI,SPI
外设: DMA,POR,PWM,WDT
输入/输出数量: 111
程序存储容量: 512KB(512K x 8)
程序存储器类型: 闪存
RAM 大小: 64K x 8
电源电压(Vcc/Vdd): 4.5V ~ 5.25V
数据转换器: A/D 40x12b
振荡器类型: 内部
工作温度: -40°C ~ 125°C(TA)
安装类型: 表面贴装型
封装/外壳: 144-LQFP
供应商器件封装: 144-LQFP(20x20)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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