NXP SGTL5000XNLA3

立体声音频I²C，串行，SPI™1 / 1-40°C ~ 85°C

Overview

The SGTL5000XNLA3 is a low power Stereo Codec with headphone amp from NXP and is designed to provide a complete audio solution for products needing LINEIN, MIC_IN, LINEOUT, headphone-out and digital I/O. Deriving its architecture from best in class, NXP integrated products that are currently on the market. This is able to achieve ultra low power with very high performance and functionality, all in one of the smallest footprints available. Capless headphone and an integrated PLL to allow clock reuse within the system that helps achieve a lower overall system cost.

Features

Tray Package
Embedded in the 20-UFQFN Exposed Pad package
Operating temperature of -40°C~85°C
1 / 1 ADCs / DACs

Surface Mount Mounting Type

Applications

There are a lot of NXP USA Inc.
SGTL5000XNLA3 CODECs Interface ICs applications.

• Autonomous vehicles & robots
• Backstop gauging
• Ball screw positioning
• Converting
• Conveying
• Cut-to-length
• Filling
• Food & beverage
• Linear measurement
• Material handling