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S9S12ZVL32F0CLF

NXP S9S12ZVL32F0CLF

S12Z32MHz32KB(32K x 8)

比较
NXP USA Inc.
S9S12ZVL32F0CLF
IC MCU 16BIT 32KB FLASH 48LQFP
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比较

¥85.60

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

S9S12ZVL16F0CLCR with pin details, that includes S12 MagniV Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 32-LQFP, it has an Operating Temperature range of -40°C ~ 85°C (TA), Supplier Device Package is designed to work in 32-LQFP (7x7), as well as the 19 Number of I O, the device can also be used as 32MHz Speed. In addition, the EEPROM Size is 128 x 8, the device is offered in S12Z Core Processor, the device has a 1K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is I2C, IrDA, LIN, SCI, SPI, UART/USART, and the Voltage Supply Vcc Vdd is 5.5 V ~ 18 V, and Core Size is 16-Bit, and the Program Memory Size is 32KB (32K x 8), and Data Converters is A/D 6x10b, and the Oscillator Type is Internal.

S9S12ZVL16F0VLC with EDA / CAD Models manufactured by NXP / Freescale. is part of the Embedded - Microcontrollers, , and with support for "16-bit Microcontrollers - MCU MagniV 16-bit MCU, * Microcontroller IC, MCU 16-bit S12Z CISC 16KB Flash Automotive 32-Pin LQFP Tray.

Features

S12 MagniV Series
48-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
S9S12ZVL32F0CLF Microcontroller applications.

  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
产品属性
全选
型号系列: S12 MagniV
包装: 托盘
部件状态: 在售
可编程: 未验证
核心处理器: S12Z
内核规格: 16 位
速度: 32MHz
连接能力: I²C,IrDA,LINbus,SCI,SPI,UART/USART
外设: LVD,POR,PWM,WDT
输入/输出数量: 34
程序存储容量: 32KB(32K x 8)
程序存储器类型: 闪存
EEPROM 容量: 128 x 8
RAM 大小: 1K x 8
电源电压(Vcc/Vdd): 5.5V ~ 18V
数据转换器: A/D 10x10b
振荡器类型: 内部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 48-LQFP
供应商器件封装: 48-LQFP(7x7)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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