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S9S12VRP64F0MLF

NXP S9S12VRP64F0MLF

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NXP USA Inc.
S9S12VRP64F0MLF
S9S12VRP64F0MLF - MC9S12VR - TOM
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价格更新:一个月前

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产品详情

Overview

The S9S12VR64F2VLC is IC MCU 16BIT 64KB FLASH 32LQFP, that includes S12 MagniV Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 32-LQFP, it has an Operating Temperature range of -40°C ~ 105°C (TA), Supplier Device Package is designed to work in 32-LQFP (7x7), as well as the 16 Number of I O, the device can also be used as 25MHz Speed. In addition, the EEPROM Size is 512 x 8, the device is offered in Core Processor, the device has a 2K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is IrDA, LIN, SCI, SPI, and the Voltage Supply Vcc Vdd is 3.13 V ~ 5.5 V, and Core Size is 16-Bit, and the Program Memory Size is 64KB (64K x 8), and Data Converters is A/D 2x10b, and the Oscillator Type is Internal.

The S9S12VR64F2CLF is IC MCU 16BIT 64KB FLASH 48LQFP, that includes Tray Packaging, they are designed to operate with a S12 MagniV Series, Peripherals is shown on datasheet note for use in a LVD, POR, PWM, WDT, that offers Connectivity features such as IrDA, LIN, SCI, SPI, Oscillator Type is designed to work in Internal, as well as the FLASH Program Memory Type, the device can also be used as A/D 6x10b Data Converters. In addition, the Program Memory Size is 64KB (64K x 8), the device is offered in 512 x 8 EEPROM Size, the device has a 48-LQFP (7x7) of Supplier Device Package, and Package Case is 48-LQFP, it has an Operating Temperature range of -40°C ~ 85°C (TA), and Voltage Supply Vcc Vdd is 3.13 V ~ 5.5 V, and the RAM Size is 2K x 8, and Number of I O is 28, and the Speed is 25MHz, and Core Size is 16-Bit, and the Core Processor is .

Features


48-LQFP package
Mounting type of Surface Mount

Bulk Package

Applications


There are a lot of NXP USA Inc.
S9S12VRP64F0MLF Microcontroller applications.

  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products
  • Digital cameras
  • DVD\DV\MP3 players
产品属性
全选
包装: 散装
部件状态: 在售
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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