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S9S12VR64F2CLC

NXP S9S12VR64F2CLC

12V125MHz64KB(64K x 8)

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NXP USA Inc.
S9S12VR64F2CLC
IC MCU 16BIT 64KB FLASH 32LQFP
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价格更新:一个月前

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产品详情

Overview

S9S12VR64AF0MLC with pin details, that includes S12 MagniV Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 32-LQFP, it has an Operating Temperature range of -40°C ~ 125°C (TA), Supplier Device Package is designed to work in 32-LQFP (7x7), as well as the 16 Number of I O, the device can also be used as 25MHz Speed. In addition, the EEPROM Size is 512 x 8, the device is offered in 12V1 Core Processor, the device has a 2K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is IrDA, LIN, SCI, SPI, and the Voltage Supply Vcc Vdd is 3.13 V ~ 5.5 V, and Core Size is 16-Bit, and the Program Memory Size is 64KB (64K x 8), and Data Converters is A/D 2x10b, and the Oscillator Type is Internal.

S9S12VR64AF0VLF with circuit diagram manufactured by NXP / Freescale. The S9S12VR64AF0VLF is available in QFP48 Package, is part of the Embedded - Microcontrollers, , and with support for "16-bit Microcontrollers - MCU MagniV 16-bit MCU, * Microcontroller IC, MCU 16-bit HCS12 CISC 64KB Flash 9V/12V/15V Automotive 48-Pin LQFP Tray.

Features

S12 MagniV Series
32-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
S9S12VR64F2CLC Microcontroller applications.

  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
产品属性
全选
型号系列: S12 MagniV
包装: 托盘
部件状态: 停产
可编程: 未验证
核心处理器: 12V1
内核规格: 16 位
速度: 25MHz
连接能力: IrDA,LINbus,SCI,SPI
外设: LVD,POR,PWM,WDT
输入/输出数量: 16
程序存储容量: 64KB(64K x 8)
程序存储器类型: 闪存
EEPROM 容量: 512 x 8
RAM 大小: 2K x 8
电源电压(Vcc/Vdd): 3.13V ~ 5.5V
数据转换器: A/D 2x10b
振荡器类型: 内部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 32-LQFP
供应商器件封装: 32-LQFP(7x7)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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