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S9S08SG8E2CTJ

NXP S9S08SG8E2CTJ

S0840MHz8KB(8K x 8)

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NXP USA Inc.
S9S08SG8E2CTJ
IC MCU 8BIT 8KB FLASH 20TSSOP
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产品详情

Overview

The S9S08SG8E2CTG is IC MCU 8BIT 8KB FLASH 16TSSOP, that includes S08 Series, they are designed to operate with a Tube Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.002194 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 16-TSSOP (0.173", 4.40mm Width), it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as 16-TSSOP Supplier Device Package. In addition, the Number of I O is 12, the device is offered in 40MHz Speed, the device has a S08 of Core Processor, and RAM Size is 512 x 8, and the Program Memory Type is FLASH, and Peripherals is LVD, POR, PWM, WDT, and the Connectivity is I2C, LIN, SCI, SPI, and Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V, and the Core Size is 8-Bit, and Program Memory Size is 8KB (8K x 8), and the Data Converters is A/D 8x10b, and Oscillator Type is Internal, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 2.7 V to 5.5 V, and Interface Type is SCI SPI, and the Core is HCS08, and Processor Series is S08SG, and the Data Bus Width is 8 bit, and Supply Voltage Max is 5.5 V, and the Supply Voltage Min is 2.7 V, and Maximum Clock Frequency is 40 MHz, and the Number of ADC Channels is 12, and Data RAM Size is 512 B, and the Number of Timers Counters is 3 Timer, and ADC Resolution is 10 bit, and the Data RAM Type is RAM.

S9S08SG8E2CSC with circuit diagram, that includes I2C, LIN, SCI, SPI Connectivity, they are designed to operate with a S08 Core Processor, Core Size is shown on datasheet note for use in a 8-Bit, that offers Data Converters features such as A/D 4x10b, Number of I O is designed to work in 4, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as Internal Oscillator Type. In addition, the Package Case is 8-SOIC (0.154", 3.90mm Width), the device is offered in Tube Packaging, the device has a LVD, POR, PWM, WDT of Peripherals, and Program Memory Size is 8KB (8K x 8), and the Program Memory Type is FLASH, and RAM Size is 512 x 8, and the Series is S08, and Speed is 40MHz, and the Supplier Device Package is 8-SOIC, and Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V.

Features

S08 Series


  • 40 MHz core

  • 4-32 KB flash range

  • 256B-1 KB RAM range

  • 1 analog comparator

  • Four package options

  • Up to 16-channel, 10-bit ADC

  • Single-wire background debug module (BDM)

  • In-circuit emulation (ICE) with real-time bus capture

  • 1 universal asynchronous receiver/transmitter (UART), 1 serial peripheral interface (SPI), 1 inter-integrated circuit (IIC)

  • This product is included in NXP?.s product longevity program, with assured supply for a minimum of 15 years after launch



Surface Mount Mounting Type

Applications


  • Automotive

    Braking and Stability Control

    Electric Power Steering (EPS)

    Hybrid Electric Vehicle (HEV) Applications

    Heating Ventilation, and Air Conditioning (HVAC)

  • Industrial

    Defibrillator

    Heart Monitors

    Heat Metering

    Industrial HMI

    Digital Stethoscope

    Vital Signs Monitors

    Powered Patient Beds

    Air Conditioning (AC)

    Home Health Gateway

    Anesthesia Unit Monitor

    Blood Glucose Management

    Smart Power Socket and Light Switch

    Continuous Positive Airway Pressure Machine (CPAP)

  • Mobile

    Hearables

    Wristband

    Input Device (Mouse, Pen, Keyboard)

  • Smart City

    Transport Ticketing

    Automatic Vehicle Identification

  • Smart Home

    Home Sensor

    Robotic Appliance

    Major Home Appliances

    Home Security & Surveillance

    Small and Medium Appliances


产品属性
全选
型号系列: S08
包装: 散装
部件状态: 在售
可编程: 未验证
核心处理器: S08
内核规格: 8 位
速度: 40MHz
连接能力: I²C,LINbus,SCI,SPI
外设: LVD,POR,PWM,WDT
输入/输出数量: 16
程序存储容量: 8KB(8K x 8)
程序存储器类型: 闪存
RAM 大小: 512 x 8
电源电压(Vcc/Vdd): 2.7V ~ 5.5V
数据转换器: A/D 12x10b
振荡器类型: 内部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)
供应商器件封装: 20-TSSOP
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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配件发货: 25M+

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