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S9S08EL32F1MTJR

NXP S9S08EL32F1MTJR

S0840MHz32KB(32K x 8)

比较
NXP USA Inc.
S9S08EL32F1MTJR
IC MCU 8BIT 32KB FLASH 20TSSOP
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比较

¥1200.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The S9S08EL32F1MTJ is IC MCU 8BIT 32KB FLASH 20TSSOP, that includes S08 Series, they are designed to operate with a Tube Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 20-TSSOP (0.173", 4.40mm Width), it has an Operating Temperature range of -40°C ~ 125°C (TA), Supplier Device Package is designed to work in 20-TSSOP, as well as the 16 Number of I O, the device can also be used as 40MHz Speed. In addition, the EEPROM Size is 512 x 8, the device is offered in S08 Core Processor, the device has a 1K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is I2C, LIN, SCI, SPI, and the Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V, and Core Size is 8-Bit, and the Program Memory Size is 32KB (32K x 8), and Data Converters is A/D 12x10b, and the Oscillator Type is External.

S9S08EL32F1CTLR with circuit diagram manufactured by NXP / Freescale. is part of the Embedded - Microcontrollers, , and with support for "8-bit Microcontrollers - MCU 8-bit MCU, * Microcontroller IC, 8-Bit HCS08 Microcontroller, 8-bit Microcontrollers - MCU 8-bit MCU, S08 core, 32KB Flash, 40MHz, -40/+85degC, Automotive Qualified.

Features

S08 Series
20-TSSOP (0.173, 4.40mm Width) package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
S9S08EL32F1MTJR Microcontroller applications.

  • Equipment control
  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
产品属性
全选
型号系列: S08
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
核心处理器: S08
内核规格: 8 位
速度: 40MHz
连接能力: I²C,LINbus,SCI,SPI
外设: LVD,POR,PWM,WDT
输入/输出数量: 16
程序存储容量: 32KB(32K x 8)
程序存储器类型: 闪存
EEPROM 容量: 512 x 8
RAM 大小: 1K x 8
电源电压(Vcc/Vdd): 2.7V ~ 5.5V
数据转换器: A/D 12x10b
振荡器类型: 外部
工作温度: -40°C ~ 125°C(TA)
安装类型: 表面贴装型
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)
供应商器件封装: 20-TSSOP
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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