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S912XEP100J5VAGR

NXP S912XEP100J5VAGR

HCS12X50MHz1MB(1M x 8)

比较
NXP USA Inc.
S912XEP100J5VAGR
IC MCU 16BIT 1MB FLASH 144LQFP
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¥490.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The S912XEP100J5MALR is IC MCU 16BIT 1MB FLASH 112LQFP, that includes HCS12X Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.045091 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 112-LQFP, it has an Operating Temperature range of -40°C ~ 125°C (TA), the device can also be used as 112-LQFP (20x20) Supplier Device Package. In addition, the Number of I O is 91, the device is offered in 50MHz Speed, the device has a 4K x 8 of EEPROM Size, and Core Processor is HCS12X, and the RAM Size is 64K x 8, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is CAN, EBI/EMI, I2C, IrDA, SCI, SPI, and the Voltage Supply Vcc Vdd is 1.72 V ~ 5.5 V, and Core Size is 16-Bit, and the Program Memory Size is 1MB (1M x 8), and Data Converters is A/D 16x12b, and the Oscillator Type is External.

S912XEP100J5MAL/MC912XEP100J5CAL/S912XEP100BMAL with circuit diagram manufactured by Freescale. The S912XEP100J5MAL/MC912XEP100J5CAL/S912XEP100BMAL is available in LQFP112 Package, is part of the IC Chips.

Features

HCS12X Series
144-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
S912XEP100J5VAGR Microcontroller applications.

  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products
  • Digital cameras
  • DVD\DV\MP3 players
产品属性
全选
型号系列: HCS12X
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
核心处理器: HCS12X
内核规格: 16 位
速度: 50MHz
连接能力: CANbus,EBI/EMI,I²C,IrDA,SCI,SPI
外设: LVD,POR,PWM,WDT
输入/输出数量: 119
程序存储容量: 1MB(1M x 8)
程序存储器类型: 闪存
EEPROM 容量: 4K x 8
RAM 大小: 64K x 8
电源电压(Vcc/Vdd): 1.72V ~ 5.5V
数据转换器: A/D 24x12b
振荡器类型: 外部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 144-LQFP
供应商器件封装: 144-LQFP(20x20)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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