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S912XEG256J2CAL

NXP S912XEG256J2CAL

HCS12X50MHz256KB(256K x 8)

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NXP USA Inc.
S912XEG256J2CAL
IC MCU 16BIT 256KB FLASH 112LQFP
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¥818.40

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

S912XEG128W1MAL with pin details, that includes HCS12X Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 112-LQFP, it has an Operating Temperature range of -40°C ~ 125°C (TA), Supplier Device Package is designed to work in 112-LQFP (20x20), as well as the 91 Number of I O, the device can also be used as 50MHz Speed. In addition, the EEPROM Size is 2K x 8, the device is offered in HCS12X Core Processor, the device has a 12K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is CAN, EBI/EMI, I2C, IrDA, SCI, SPI, and the Voltage Supply Vcc Vdd is 1.72 V ~ 5.5 V, and Core Size is 16-Bit, and the Program Memory Size is 128KB (128K x 8), and Data Converters is A/D 12x12b, and the Oscillator Type is External.

S912XEG256BVALR with EDA / CAD Models manufactured by NXP / Freescale. is part of the Embedded - Microcontrollers, , and with support for "16-bit Microcontrollers - MCU 16-bit MCU, * Microcontroller IC, MCU 16-bit HCS12X RISC 256KB Flash 3.3V/5V Automotive 112-Pin LQFP T/R.

Features

HCS12X Series
112-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
S912XEG256J2CAL Microcontroller applications.

  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
产品属性
全选
型号系列: HCS12X
包装: 托盘
部件状态: 停产
可编程: 未验证
核心处理器: HCS12X
内核规格: 16 位
速度: 50MHz
连接能力: CANbus,EBI/EMI,I²C,IrDA,SCI,SPI
外设: LVD,POR,PWM,WDT
输入/输出数量: 91
程序存储容量: 256KB(256K x 8)
程序存储器类型: 闪存
EEPROM 容量: 4K x 8
RAM 大小: 16K x 8
电源电压(Vcc/Vdd): 1.72V ~ 5.5V
数据转换器: A/D 16x12b
振荡器类型: 外部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 112-LQFP
供应商器件封装: 112-LQFP(20x20)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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