
NXP S912XDG128F2MAAR
HCS12X80MHz128KB(128K x 8)
比较






¥412.08
价格更新:一个月前博斯克质量保证







Overview
The S912XDG128F2CAL is IC MCU 16BIT 128KB FLASH 112LQFP, that includes HCS12X Series, they are designed to operate with a Tray Packaging, Unit Weight is shown on datasheet note for use in a 0.045091 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 112-LQFP, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as 112-LQFP (20x20) Supplier Device Package. In addition, the Number of I O is 91, the device is offered in 80MHz Speed, the device has a 2K x 8 of EEPROM Size, and Core Processor is HCS12X, and the RAM Size is 12K x 8, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is CAN, I2C, SCI, SPI, and the Voltage Supply Vcc Vdd is 2.35 V ~ 5.5 V, and Core Size is 16-Bit, and the Program Memory Size is 128KB (128K x 8), and Data Converters is A/D 8x10b, 16x10b, and the Oscillator Type is External, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Voltage is 2.5 V 5 V, and the Interface Type is CAN I2C SCI SPI, and Core is HCS12X, and the Data Bus Width is 16 bit, and Maximum Clock Frequency is 40 MHz, and the Number of ADC Channels is 16, and Number of I Os is 91 I/O, and the Data RAM Size is 12 kB, and Number of Timers Counters is 12 Timer, and the ADC Resolution is 10 bit.
The S912XDG128F2CAA is IC MCU 16BIT 128KB FLASH 80QFP, that includes Tray Alternate Packaging Packaging, they are designed to operate with a LVD, POR, PWM, WDT Peripherals, Series is shown on datasheet note for use in a HCS12X, that offers Core Processor features such as HCS12X, Program Memory Type is designed to work in FLASH, as well as the External Oscillator Type, the device can also be used as CAN, I2C, SCI, SPI Connectivity. In addition, the Data Converters is A/D 8x10b, 16x10b, the device is offered in 80-QFP (14x14) Supplier Device Package, the device has a 80-QFP of Package Case, and Speed is 80MHz, and the Number of I O is 59, it has an Operating Temperature range of -40°C ~ 85°C (TA), and the EEPROM Size is 2K x 8, and Voltage Supply Vcc Vdd is 2.35 V ~ 5.5 V, and the Core Size is 16-Bit, and RAM Size is 12K x 8, and the Program Memory Size is 128KB (128K x 8).
Features
HCS12X Series80-QFP package
Mounting type of Surface Mount
Surface Mount Mounting Type
Applications
There are a lot of NXP USA Inc.
S912XDG128F2MAAR Microcontroller applications.
- Calculator
- Kindle
- Christmas lights
- 3D printers
- Washing machine
- Microwave ovens
- Home appliances
- Home video and audio
- Entertainment products
- Digital cameras
- 起步价为$40,南非、巴西、印度、巴基斯坦、以色列等国家的价格会有所变动,详情请咨询相关客服人员。
- 包裹重量≤0.5kg的基本运费根据时区和国家而定。
- 我们的产品目前使用DHL,顺丰和UPS运输。如果数量少,则选择联邦快递。
- 一旦发货,预期交货时间跟选择的运输方式有所变动。
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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实时新闻
博斯克数字
收入: 85M
2022年的收入为8500万美元,与2021年增长63%。
国家: 105
博斯克服务全球105个国家的客户。
配件发货: 25M+
我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。
制造商: 950
2022年,博斯克从近950个制造商售卖了配件。
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