NXP RD-KL25-AGMP01

加速计，陀螺仪，电子罗盘，压力，温度

Overview

The 1-1825376-2 is CONN IC DIP SOCKET 28POS GOLD, that includes Diplomate DL Series, they are designed to operate with a DIP, 0.6" (15.24mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Thermoplastic, Glass Filled, the device is offered in 28 (2 x 14) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Gold, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 30μin (0.76μm), and Contact Material Post is Beryllium Copper.

1-1825286-0 with circuit diagram, that includes Number of Positions.

Features

Bulk Package
Accelerometer, Gyroscope, Electronic Compass, Pressure, Temperature Sensor Type
Board(s), Cable(s) Supplied Contents
BC3770, FXAS21002, FXOS8700CQ, K20, KL25Z, MPL3115A2 Utilized IC / Part