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QN9022/DY

NXP QN9022/DY

蓝牙 v4.02.4GHz4dBm

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NXP USA Inc.
QN9022/DY
IC RF TXRX BLUETOOTH 40VFQFN
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¥16.11

价格更新:一个月前

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产品详情

Overview

QN9020/DY with pin details, that includes TxRx Only Type, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 48-VFQFN Exposed Pad, that offers Frequency features such as 2.4GHz, it has an Operating Temperature range of -40°C ~ 85°C, as well as the -95dBm Sensitivity, the device can also be used as 2.4 V ~ 3.6 V Voltage Supply. In addition, the Memory Size is 128kB Flash, the device is offered in Bluetooth v4.0 Protocol, the device has a I2C, SPI, UART of Serial Interfaces, and Power Output is 4dBm, and the Current Receiving is 9.2mA, and RF Family Standard is Bluetooth, and the GPIO is 31, and Current Transmitting is 8.8mA.

The QN9020DK598 is Bluetooth / 802.15.1 Development Tools QN9020 Mini Dev Kit, that includes Bluetooth Dongles For Use With, they are designed to operate with a USB UART Interface Type, Operating Supply Voltage is shown on datasheet note for use in a 3 V, that offers Product features such as Development Boards, Tool Is For Evaluation Of is designed to work in QN9020.

Features

Tape & Reel (TR) Package
40-VFQFN Exposed Pad package
Surface Mount for mounting
TxRx Only
Tape & Reel (TR) is used

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
QN9022/DY RF Transceiver ICs applications.

  • Internet Radio
  • Industrial Controls
  • Chemical Sensors
  • Security Systems
  • M2M Communication
  • Remote Device Management
  • Low-power IoT applications
  • LoT applications
  • Power Amplifier (PA)
  • Low Noise Amplifier (LNA)
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
类型: 仅限 TxRx
射频系列/标准: 蓝牙
协议: 蓝牙 v4.0
频率: 2.4GHz
输出功率: 4dBm
灵敏度: -95dBm
存储容量: 128kB 闪存
串行接口: I²C,SPI,UART
GPIO(通用输入/输出): 31
电源电压: 2.4V ~ 3.6V
电流 - 接收: 9.2mA
电流 - 传输: 8.8mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
封装/外壳: 40-VFQFN 裸露焊盘
供应商器件封装: 40-HVQFN(5x5)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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