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PK30X256VLQ100

NXP PK30X256VLQ100

ARM® Cortex®-M4100MHz256KB(256K x 8)

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NXP USA Inc.
PK30X256VLQ100
IC MCU 32BIT 256KB FLASH 144LQFP
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价格更新:一个月前

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产品详情

Overview

The PK30X128VMD100 is IC MCU 32BIT 128KB FLASH 144BGA, that includes Kinetis K30 Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 144-LBGA, it has an Operating Temperature range of -40°C ~ 105°C (TA), Supplier Device Package is designed to work in 144-MAPBGA (13x13), as well as the 102 Number of I O, the device can also be used as 100MHz Speed. In addition, the EEPROM Size is 4K x 8, the device is offered in Core Processor, the device has a 32K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is DMA, I2S, LCD, LVD, POR, PWM, WDT, and Connectivity is CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, and the Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and Core Size is 32-Bit, and the Program Memory Size is 128KB (128K x 8), and Data Converters is A/D 31x16b, D/A 2x12b, and the Oscillator Type is Internal.

PK30X-2 with circuit diagram, that includes Alligator Clip Accessory Type, they are designed to operate with a LeCroy Passive Probes For Use With Related Products, Series is shown on datasheet note for use in a , that offers Type features such as Test Clip, Lead, Probe.

Features

Kinetis K30 Series
144-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
PK30X256VLQ100 Microcontroller applications.

  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
产品属性
全选
型号系列: Kinetis K30
包装: 散装
部件状态: 停产
可编程: 未验证
核心处理器: ARM® Cortex®-M4
内核规格: 32 位单核
速度: 100MHz
连接能力: CANbus,EBI/EMI,I²C,IrDA,SD,SPI,UART/USART
外设: DMA,I²S,LCD,LVD,POR,PWM,WDT
输入/输出数量: 102
程序存储容量: 256KB(256K x 8)
程序存储器类型: 闪存
EEPROM 容量: 4K x 8
RAM 大小: 64K x 8
电源电压(Vcc/Vdd): 1.71V ~ 3.6V
数据转换器: A/D 31x16b; D/A 2x12b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 144-LQFP
供应商器件封装: 144-LQFP(20x20)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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