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PIP3213-R,118

NXP PIP3213-R,118

通用1不需要18A

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NXP USA Inc.
PIP3213-R,118
IC PWR DRIVER N-CHAN 1:1 SOT426
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产品详情

Overview

The PIP3210-R,118 is TOPFET PWR SWITCH D2PAK, that includes TOPFET? Series, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a TO-263-5, D2Pak (4 Leads + Tab), TO-263BB, that offers Input Type features such as Non-Inverting, Output Type is designed to work in N-Channel, as well as the On/Off Interface, the device can also be used as SOT-426 Supplier Device Package. In addition, the Ratio Input:Output is 1899/12/30 1:01:00, the device is offered in 1 Number of Outputs, the device has a Not Required of Voltage Supply Vcc Vdd, and Fault Protection is Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage, and the Output Configuration is High Side, and Rds On Typ is 28 mOhm, and the Voltage Load is 5.5 V ~ 35 V, and Current Output Max is 20A, and the Switch Type is General Purpose.

The PIP3213-R is MOSFET N-CH 50V 18A SOT426 manufactured by PHI. The PIP3213-R is available in TO-263-5, D²Pak (4 Leads + Tab), TO-263BB Package, is part of the PMIC - Power Distribution Switches, Load Drivers, , and with support for MOSFET N-CH 50V 18A SOT426.

Features

TOPFET™ Series
Tape & Reel (TR) Package
General Purpose Switch Type
1 Number of Outputs
1:1 Ratio - Input:Output
High Side Output Configuration
On/Off Interface
5.5V ~ 35V Voltage - Load
Not Required Voltage - Supply (Vcc/Vdd)
18A Current - Output (Max)
15mOhm Rds On (Typ)
Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Fault Protection
Surface Mount Mounting Type
D2PAK Supplier Device Package
产品属性
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型号系列: TOPFET™
包装: 卷带(TR)
部件状态: 停产
开关类型: 通用
输出数: 1
输入输出比: 1:1
输出配置: 高端
输出类型: N 通道
接口: 开/关
负载电压: 5.5V ~ 35V
电源电压(Vcc/Vdd): 不需要
电流 - 输出(最大值): 18A
典型通态电阻: 15 毫欧
输入类型: 非反相
故障保护: 限流(固定),开路负载检测,超温,过压
安装类型: 表面贴装型
供应商器件封装: D2PAK
封装/外壳: TO-263-5,D²Pak(4 引线 + 接片),TO-263BB
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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