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PIP3102-R,118

NXP PIP3102-R,118

通用1不需要30A

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NXP USA Inc.
PIP3102-R,118
IC PWR DRIVER N-CHAN 1:1 SOT426
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Overview

The PIP3101-A,127 is MOSFET N-CH 50V 30A SOT263B-01, that includes TOPFET? Series, they are designed to operate with a Tube Packaging, Package Case is shown on datasheet note for use in a TO-220-5 Formed Leads, that offers Input Type features such as Non-Inverting, Output Type is designed to work in N-Channel, as well as the Status Flag Features, the device can also be used as On/Off Interface. In addition, the Supplier Device Package is SOT263-01, the device is offered in 1899/12/30 1:01:00 Ratio Input:Output, the device has a 1 of Number of Outputs, and Voltage Supply Vcc Vdd is Not Required, and the Fault Protection is Current Limiting (Fixed), Over Temperature, Over Voltage, and Output Configuration is Low Side, and the Rds On Typ is 21 mOhm, and Voltage Load is 50V (Max), and the Current Output Max is 30A, and Switch Type is General Purpose.

The PIP3102-R is MOSFET N-CH 50V 30A SOT426 manufactured by PHI. The PIP3102-R is available in TO-263-5, D²Pak (4 Leads + Tab), TO-263BB Package, is part of the PMIC - Power Distribution Switches, Load Drivers, , and with support for MOSFET N-CH 50V 30A SOT426.

Features

TOPFET™ Series
Tape & Reel (TR) Package
General Purpose Switch Type
1 Number of Outputs
1:1 Ratio - Input:Output
Low Side Output Configuration
On/Off Interface
50V (Max) Voltage - Load
Not Required Voltage - Supply (Vcc/Vdd)
30A Current - Output (Max)
21mOhm Rds On (Typ)
Status Flag Features
Current Limiting (Fixed), Over Temperature, Over Voltage Fault Protection
Surface Mount Mounting Type
D2PAK Supplier Device Package
产品属性
全选
型号系列: TOPFET™
包装: 卷带(TR)
部件状态: 停产
开关类型: 通用
输出数: 1
输入输出比: 1:1
输出配置: 低端
输出类型: N 通道
接口: 开/关
负载电压: 50V(最大)
电源电压(Vcc/Vdd): 不需要
电流 - 输出(最大值): 30A
典型通态电阻: 21 毫欧
输入类型: 非反相
特性: 状态标志
故障保护: 限流(固定),超温,过压
安装类型: 表面贴装型
供应商器件封装: D2PAK
封装/外壳: TO-263-5,D²Pak(4 引线 + 接片),TO-263BB
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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