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PESD5V0C1UZF315

NXP PESD5V0C1UZF315

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NXP USA Inc.
PESD5V0C1UZF315
PESD5V0C1UZF - ULTRA LOW CAPACIT
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¥0.19

价格更新:一个月前

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产品详情

Overview

PESD5V0C1BSFYL with pin details, that includes TrEOS Series, they are designed to operate with a Zener Type, Packaging is shown on datasheet note for use in a Digi-ReelR Alternate Packaging, that offers Termination Style features such as SMD/SMT, Package Case is designed to work in 2-XFDFN, it has an Operating Temperature range of -40°C ~ 125°C (TA), the device can also be used as Surface Mount Mounting Type. In addition, the Applications is General Purpose, the device is offered in 1 Channel Number of Channels, the device has a DSN0603-2 of Supplier Device Package, and Bidirectional Channels is 1, and the Voltage Reverse Standoff Typ is 5V (Max), and Voltage Breakdown Min is 6V, and the Voltage Clamping Max Ipp is 6.5V (Typ), and Current Peak Pulse 10 1000μs is 16A (100ns), and the Power Line Protection is No, and Capacitance Frequency is 0.2pF @ 1MHz, it has an Maximum Operating Temperature range of + 150 C, and Breakdown Voltage is 6 V, and the Clamping Voltage is 5.5 V, and Cd Diode Capacitance is 0.2 pF, and the Working Voltage is 5 V, and Polarity is Bidirectional, and the Ipp Peak Pulse Current is 9 A, and Vesd Voltage ESD Contact is 20 kV, and the Vesd Voltage ESD Air Gap is 20 kV.

The PESD3V3X1BL,315 is TVS DIODE 3.3VWM SOD882, that includes Automotive Applications, they are designed to operate with a 1 Bidirectional Channels, Capacitance Frequency is shown on datasheet note for use in a 1.3pF @ 1MHz, that offers Mounting Type features such as Surface Mount, it has an Operating Temperature range of -55°C ~ 150°C (TA), as well as the SOD-882 Package Case, the device can also be used as Digi-ReelR Alternate Packaging Packaging. In addition, the Power Line Protection is No, the device is offered in Automotive, AEC-Q101 Series, the device has a SOD-882 of Supplier Device Package, and Type is Zener, and the Voltage Breakdown Min is 5V, and Voltage Reverse Standoff Typ is 3.3V (Max).

Features

Bulk Package
产品属性
全选
包装: 散装
部件状态: 在售
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

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配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

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