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PCK942PBD,157

NXP PCK942PBD,157

扇出缓冲器(分配)11:18

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NXP USA Inc.
PCK942PBD,157
IC CLK BUFFER 1:18 250MHZ 32LQFP
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产品详情

Overview

The PCK942PBD,128 is IC CLK BUFFER 1:18 250MHZ 32LQFP, that includes Fanout Buffer (Distribution) Type, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 32-LQFP, it has an Operating Temperature range of 0°C ~ 70°C, Mounting Type is designed to work in Surface Mount, as well as the 2.375 V ~ 3.465 V Voltage Supply, the device can also be used as 32-LQFP (7x7) Supplier Device Package. In addition, the Input is LVPECL, the device is offered in LVCMOS Output, the device has a 1 of Number of Circuits, and Ratio Input:Output is 1899/12/30 1:18:00, and the Differential Input:Output is Yes/No, and Frequency Max is 250MHz.

The PCK942PBD,151 is IC CLK BUFFER 1:18 250MHZ 32LQFP, that includes Yes/No Differential Input:Output, they are designed to operate with a 250MHz Frequency Max, Input is shown on datasheet note for use in a LVPECL, that offers Mounting Type features such as Surface Mount, Number of Circuits is designed to work in 1, it has an Operating Temperature range of 0°C ~ 70°C, the device can also be used as LVCMOS Output. In addition, the Package Case is 32-LQFP, the device is offered in Tray Packaging, the device has a 1899/12/30 1:18:00 of Ratio Input:Output, and Supplier Device Package is 32-LQFP (7x7), and the Type is Fanout Buffer (Distribution), and Voltage Supply is 2.375 V ~ 3.465 V.

Features

Tray Package
Fanout Buffer (Distribution) Type
1 Number of Circuits
1:18 Ratio - Input:Output
Yes/No Differential - Input:Output
LVPECL Input
LVCMOS Output
250 MHz Frequency - Max
2.375V ~ 3.465V Voltage - Supply
0°C ~ 70°C Operating Temperature
Surface Mount Mounting Type
产品属性
全选
包装: 托盘
部件状态: 停产
类型: 扇出缓冲器(分配)
电路数: 1
输入输出比: 1:18
差分输入至输出: 是/无
输入: LVPECL
输出: LVCMOS
频率 - 最大值: 250 MHz
电源电压: 2.375V ~ 3.465V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装型
封装/外壳: 32-LQFP
供应商器件封装: 32-LQFP(7x7)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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