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PCF85063TP/1Z

NXP PCF85063TP/1Z

时钟/日历警报器,闰年,方波输出

比较
NXP USA Inc.
PCF85063TP/1Z
IC RTC CLK/CALENDAR I2C 8HWSON
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比较

¥2.02

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The PCF85063ATT/AJ is IC RTC CLK/CALENDAR I2C 8TSSOP, that includes Real Time Clocks Product, they are designed to operate with a Clock/Calendar Type, Packaging is shown on datasheet note for use in a Digi-ReelR Alternate Packaging, that offers Unit Weight features such as 0.005573 oz, Mounting Style is designed to work in SMD/SMT, as well as the 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Package Case, it has an Operating Temperature range of -40°C ~ 85°C. In addition, the Mounting Type is Surface Mount, the device is offered in Alarm, Leap Year, Square Wave Output Features, the device has a Clock Calendar Alarm of Function, and Interface is I2C, 2-Wire Serial, and the Voltage Supply is 0.9 V ~ 5.5 V, and Supplier Device Package is 8-TSSOP, and the Time Format is HH:MM:SS (12/24 hr), and Date Format is YY-MM-DD-dd, and the Current Timekeeping Max is 0.6μA @ 3.3V, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Battery Backup Switching is Backup Switching, and the Supply Voltage Max is 5.5 V, and Supply Voltage Min is 900 mV, and the RTC Bus Interface is I2C.

PCF85063TP/1 with circuit diagram manufactured by NXP. The PCF85063TP/1 is available in SMD Package, is part of the IC Chips.

Features

Tape & Reel (TR) Package
8-WFDFN Exposed Pad package
8 terminations
8 pin count
1.2/5V power supplies

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
PCF85063TP/1Z Real Time Clocks applications.

  • Copy machines
  • Mobile equipment
  • Battery powered devices
  • Printers and copiers
  • Electronic metering
  • Digital cameras
  • White goods
  • Elapsed time counter
  • Network powered devices
  • Battery backed up systems
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
类型: 时钟/日历
特性: 警报器,闰年,方波输出
时间格式: HH:MM:SS(12/24 小时)
日期格式: YY-MM-DD-dd
接口: I²C,2 线串口
电源电压: 0.9V ~ 5.5V
电流 - 计时(最大值): 0.6µA @ 3.3V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
封装/外壳: 8-WFDFN 裸露焊盘
供应商器件封装: 8-HWSON(2x3)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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配件发货: 25M+

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