联系我们
中文
P1023NSN5CFB

NXP P1023NSN5CFB

PowerPC e500v2500MHzDDR3,DDR3L10/100/1000Mbps(2)0°C ~ 105°C(TA)

比较
NXP USA Inc.
P1023NSN5CFB
IC MPU QORIQ P1 500MHZ 457TEPBGA
paypalvisamastercarddiscover
upsdhlsf
比较

¥297.15

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

The P1023NSN5CFB and P1017 processors offer the value of integrated high-performance data path offload for networking protocols and dual e500 Power Architecture® cores for application software. The P1023NSN5CFB and P1017 are ideally suited for high-performance enterprise WLAN, fixed routers and security gateway applications. The P1023NSN5CFB device supports a 400–800 MHz performance range, along with advanced security and a rich set of interfaces—all delivered on 45 nm technology for low-power implementation.

The P1023NSN5CFB processor includes a performance-optimized implementation of the QorIQ® data path acceleration architecture (DPAA). This architecture provides the infrastructure to support simplified sharing of networking interfaces and accelerators by multiple CPU cores. The DPAA significantly reduces software overhead associated with high touch packet forwarding operations. Examples of the types of packet processing services this architecture is optimized to support include traditional routing and bridging, firewall, VPN termination for IPsec and MACsec (a standardized form of Ethernet encapsulation that can be used to provide confidentiality).

Features

QorIQ P1 Series
Bulk Package
PowerPC e500v2 Core Processor
500MHz Speed
DDR3, DDR3L RAM Controllers
No Graphics Acceleration
10/100/1000Mbps (2) Ethernet
USB 2.0 + PHY (1) USB
0°C ~ 105°C (TA) Operating Temperature
Surface Mount Mounting Type
产品属性
全选
型号系列: QorIQ P1
包装: 散装
部件状态: 在售
核心处理器: PowerPC e500v2
每总线宽度内核数: 2 核,32 位
速度: 500MHz
RAM 控制器: DDR3,DDR3L
图形加速: 无
以太网: 10/100/1000Mbps(2)
USB(通用串行总线): USB 2.0 + PHY(1)
工作温度: 0°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 457-FBGA
供应商器件封装: 457-TEPBGA-1(19x19)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z