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OH186,115

NXP OH186,115

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NXP USA Inc.
OH186,115
IC POWER SIP3
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产品详情

Overview

OH100-70503CF-024.576M with pin details, that includes OH100 Series, they are designed to operate with a OCXO Type, Packaging is shown on datasheet note for use in a Bulk, that offers Height features such as 0.500" (12.70mm), Package Case is designed to work in 5-DIP, as well as the 24.576MHz Frequency, it has an Operating Temperature range of -20°C ~ 70°C. In addition, the Mounting Type is Through Hole, the device is offered in 1.000" L x 1.000" W (25.40mm x 25.40mm) Size Dimension, the device has a 3.3V of Voltage Supply, and Output is CMOS, and the Frequency Stability is ±5ppb.

OH137A1 with circuit diagram manufactured by OH. The OH137A1 is available in TO-92S Package, is part of the IC Chips.

Features

Bulk Package
产品属性
全选
包装: 散装
部件状态: 停产
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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