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MSC8156HVT1000B

NXP MSC8156HVT1000B

SC3850 六核以太网,I²C,PCI,RGMII,串行 RapidIO,SGMII,SPI,UART/USART1GHz1.03125MB0°C ~ 105°C(TJ)

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NXP USA Inc.
MSC8156HVT1000B
MSC8156 - STARCORE DSP, 6X 1GHZ
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¥1421.77

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The MSC8156HVT1000B is based on the industry's highest-performance DSP core built on StarCore® technology and designed for the advanced processing requirements and capabilities of today's high-performance applications for the wireless broadband, medical imaging, aerospace, defense and advanced test and measurement markets. It delivers industry-leading performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to a 6 GHz single-core device. The MSC8156HVT1000B helps equipment manufacturers create end products and services that integrate more functionality in a smaller hardware footprint.

The MSC8156HVT1000B embeds large internal memory and supports a variety of advanced high-speed interface types, including two RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface and four multi-channel TDM interfaces. The MSC8156HVT1000B allows a high degree of scalability through pin compatibility with all MSC825x and MSC815x DSP devices.

Features

StarCore Series
Bulk Package
SC3850 Six Core Type
Ethernet, I²C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Interface
1GHz Clock Rate
ROM (96kB) Non-Volatile Memory
1.03125MB On-Chip RAM
2.50V Voltage - I/O
1V Voltage - Core
0°C ~ 105°C (TJ) Operating Temperature
Surface Mount Mounting Type
产品属性
全选
型号系列: StarCore
包装: 散装
部件状态: 停产
类型: SC3850 六核
接口: 以太网,I²C,PCI,RGMII,串行 RapidIO,SGMII,SPI,UART/USART
时钟速率: 1GHz
非易失性存储器: ROM(96kB)
片载 RAM: 1.03125MB
输入/输出电压: 2.50V
核心电压: 1V
工作温度: 0°C ~ 105°C(TJ)
安装类型: 表面贴装型
封装/外壳: 783-BBGA,FCBGA
供应商器件封装: 783-FCPBGA(29x29)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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