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MSC8154ETAG1000B

NXP MSC8154ETAG1000B

SC3850 四核以太网,I²C,PCI,RGMII,串行 RapidIO,SGMII,SPI,UART/USART1GHz576kB-40°C ~ 105°C(TJ)

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NXP USA Inc.
MSC8154ETAG1000B
IC DSP 4X 1GHZ SC3850 783FCBGA
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价格更新:一个月前

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产品详情

Overview

The MSC8154ETAG1000B device is one of Our fourth-generation high-end multicore DSP devices that target broadband wireless base stations and other communications infrastructure with security processing. The MSC8154ETAG1000B is a four-core DSP based on NXP’s SC3850 StarCore® technology and designed to advance the capabilities of wireless broadband equipment. It delivers industry-leading performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to a 4 GHz single-core device. The MSC8154ETAG1000B helps equipment manufacturers and carriers create solutions and services that enable near-term, mainstream adoption of next-generation wireless standards such as 3G-LTE, WiMAX, HSPA+ and TDD-LTE. The device is designed to lower system costs by integrating functionality into a single device that previously required multiple discrete parts.

The MSC8154ETAG1000B embeds large internal memory and supports a variety of advanced, high-speed interface types, including two RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface, four multi-channel TDM interfaces and a security encryption/decryption processor (SEC).

Features

StarCore Series
Supplied in the 783-BBGA, FCBGA package

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MSC8154ETAG1000B DSP applications.

  • Seismology
  • Audio
  • Sonar
  • Voice recognition
  • Financial signals
  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
  • Digital image processing, data compression
  • Video coding, audio coding
产品属性
全选
型号系列: StarCore
包装: 托盘
部件状态: 停产
类型: SC3850 四核
接口: 以太网,I²C,PCI,RGMII,串行 RapidIO,SGMII,SPI,UART/USART
时钟速率: 1GHz
非易失性存储器: ROM(96kB)
片载 RAM: 576kB
输入/输出电压: 2.50V
核心电压: 1.00V
工作温度: -40°C ~ 105°C(TJ)
安装类型: 表面贴装型
封装/外壳: 783-BBGA,FCBGA
供应商器件封装: 783-FCPBGA(29x29)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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