
NXP MSC8154ETAG1000B
SC3850 四核以太网,I²C,PCI,RGMII,串行 RapidIO,SGMII,SPI,UART/USART1GHz576kB-40°C ~ 105°C(TJ)
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Overview
The MSC8154ETAG1000B device is one of Our fourth-generation high-end multicore DSP devices that target broadband wireless base stations and other communications infrastructure with security processing. The MSC8154ETAG1000B is a four-core DSP based on NXP’s SC3850 StarCore® technology and designed to advance the capabilities of wireless broadband equipment. It delivers industry-leading performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to a 4 GHz single-core device. The MSC8154ETAG1000B helps equipment manufacturers and carriers create solutions and services that enable near-term, mainstream adoption of next-generation wireless standards such as 3G-LTE, WiMAX, HSPA+ and TDD-LTE. The device is designed to lower system costs by integrating functionality into a single device that previously required multiple discrete parts.
The MSC8154ETAG1000B embeds large internal memory and supports a variety of advanced, high-speed interface types, including two RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface, four multi-channel TDM interfaces and a security encryption/decryption processor (SEC).
Features
StarCore SeriesSupplied in the 783-BBGA, FCBGA package
Surface Mount Mounting Type
Applications
There are a lot of NXP USA Inc.
MSC8154ETAG1000B DSP applications.
- Seismology
- Audio
- Sonar
- Voice recognition
- Financial signals
- Other sensor array processing
- Spectral density estimation
- Statistical signal processing
- Digital image processing, data compression
- Video coding, audio coding
- 起步价为$40,南非、巴西、印度、巴基斯坦、以色列等国家的价格会有所变动,详情请咨询相关客服人员。
- 包裹重量≤0.5kg的基本运费根据时区和国家而定。
- 我们的产品目前使用DHL,顺丰和UPS运输。如果数量少,则选择联邦快递。
- 一旦发货,预期交货时间跟选择的运输方式有所变动。
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
热门零件号
实时新闻
博斯克数字
收入: 85M
2022年的收入为8500万美元,与2021年增长63%。
国家: 105
博斯克服务全球105个国家的客户。
配件发货: 25M+
我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。
制造商: 950
2022年,博斯克从近950个制造商售卖了配件。
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