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MSC8103M1100F

NXP MSC8103M1100F

SC140 内核Communications Processor Module (CPM)275MHz512kB-40°C ~ 105°C(TJ)

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NXP USA Inc.
MSC8103M1100F
DSP, 16 BIT SIZE, 64-EXT BIT, 68
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¥194.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The MSC8101VT1375F is IC DSP 16BIT 250MHZ 332-FCPBGA, that includes StarCore Series, they are designed to operate with a SC140 Core Type, Packaging is shown on datasheet note for use in a Tray, that offers Package Case features such as 332-BFBGA, FCPBGA, it has an Operating Temperature range of -40°C ~ 105°C (TJ), as well as the Surface Mount Mounting Type, the device can also be used as Communications Processor Module (CPM) Interface. In addition, the Supplier Device Package is 332-FCBGA (17x17), the device is offered in 275MHz Clock Rate, the device has a External of Non Volatile Memory, and On Chip RAM is 512kB, and the Voltage I O is 3.30V, and Voltage Core is 1.60V.

MSC8102M4400 with circuit diagram manufactured by FREESCALE. The MSC8102M4400 is available in BGA Package, is part of the IC Chips.

Features

StarCore Series
Supplied in the 332-BFBGA, FCBGA package

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MSC8103M1100F DSP applications.

  • Audio
  • Sonar
  • Voice recognition
  • Financial signals
  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
  • Digital image processing, data compression
  • Video coding, audio coding
  • Image compression
产品属性
全选
型号系列: StarCore
包装: 散装
部件状态: 在售
类型: SC140 内核
接口: Communications Processor Module (CPM)
时钟速率: 275MHz
非易失性存储器: 外部
片载 RAM: 512kB
输入/输出电压: 3.30V
核心电压: 1.60V
工作温度: -40°C ~ 105°C(TJ)
安装类型: 表面贴装型
封装/外壳: 332-BFBGA, FCBGA
供应商器件封装: 332-FCBGA (17x17)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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