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MSC7119VF1200

NXP MSC7119VF1200

定点主机接口,I²C,UART300MHz464kB-40°C ~ 105°C(TJ)

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NXP USA Inc.
MSC7119VF1200
DSP, 0-EXT BIT, 300MHZ PBGA400
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¥485.27

价格更新:一个月前

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产品详情

Overview

The MSC7118VF1200 is DSP 16BIT W/DDR CTRLR 400-MAPBGA, that includes StarCore Series, they are designed to operate with a Fixed Point Type, Packaging is shown on datasheet note for use in a Tray, that offers Package Case features such as 400-LFBGA, it has an Operating Temperature range of -40°C ~ 105°C (TJ), as well as the Surface Mount Mounting Type, the device can also be used as Host Interface, I2C, UART Interface. In addition, the Supplier Device Package is 400-MAPBGA (17x17), the device is offered in 300MHz Clock Rate, the device has a ROM (8 kB) of Non Volatile Memory, and On Chip RAM is 464kB, and the Voltage I O is 3.30V, and Voltage Core is 1.20V.

The MSC7116VM800 is IC DSP PROCESSOR 16BIT 400MAPBGA, that includes 200MHz Clock Rate, they are designed to operate with a Host Interface, I2C, UART Interface, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Non Volatile Memory features such as External, On Chip RAM is designed to work in 400kB, it has an Operating Temperature range of -40°C ~ 105°C (TJ), the device can also be used as 400-LFBGA Package Case. In addition, the Packaging is Tray, the device is offered in StarCore Series, the device has a 400-MAPBGA (17x17) of Supplier Device Package, and Type is SC1400 Core, and the Voltage Core is 1.20V, and Voltage I O is 3.30V.

Features

StarCore Series
Supplied in the 400-LFBGA package

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MSC7119VF1200 DSP applications.

  • Sonar
  • Voice recognition
  • Financial signals
  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
  • Digital image processing, data compression
  • Video coding, audio coding
  • Image compression
  • Signal processing for telecommunications
产品属性
全选
型号系列: StarCore
包装: 散装
部件状态: 在售
类型: 定点
接口: 主机接口,I²C,UART
时钟速率: 300MHz
非易失性存储器: ROM(8kB)
片载 RAM: 464kB
输入/输出电压: 3.30V
核心电压: 1.20V
工作温度: -40°C ~ 105°C(TJ)
安装类型: 表面贴装型
封装/外壳: 400-LFBGA
供应商器件封装: 400-MAPBGA(17x17)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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