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MPR111EKR2

NXP MPR111EKR2

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NXP USA Inc.
MPR111EKR2
IC SENS PROXIMITY ANLG 54-SOIC
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产品详情

Overview

MPR0854FPXXXZ01A with pin details, that includes MPR Series, they are designed to operate with a Front End Supplies Product, Type is shown on datasheet note for use in a Front End, that offers Unit Weight features such as 2.403 lbs, Mounting Style is designed to work in Rack, as well as the 1.57 in Height, the device can also be used as 8.683 in Length. In addition, the Width is 3.4 in, it has an Operating Temperature range of -10°C ~ 70°C (With Derating), the device has a Rack Mount of Mounting Type, and Features is Hot Swappable, I2C? Interface, Load Sharing, PFC, PMBus?, Remote On/Off, Remote Sense, Standby Output, Universal Input, and the Size Dimension is 8.93" L x 3.40" W x 1.57" H (226.8mm x 86.4mm x 39.9mm), and Applications is ITE (Commercial), and the Power Watts is 800W, and Voltage Input is 90 ~ 264 VAC, and the Number of Outputs is 1, and Current Output Max is 14.8A, and the Voltage Isolation is 3kV (3000V), and Output Power is 800 W, and the Voltage Output 1 is 54V, and Efficiency is 0.88, and the Dimensions is 8.683 in L x 3.4 in W x 1.57 in H, and Input Voltage is 90 VAC to 264 VAC, and the Output Voltage Channel 1 is 54 V, and Output Current Channel 1 is 14.8 A, and the Commercial Medical is Commercial, and Isolation Voltage is 3 kV, and the Open Frame Enclosed is Enclosed, and Load Regulation is Regulated, and the Input Frequency is 47 Hz to 63 Hz.

The MPR111EK is IC SENS PROXIMITY ANLG 54-SOIC, that includes Number of Inputs, they are designed to operate with a 54-SOIC (0.295", 7.50mm Width) Exposed Pad Package Case, Packaging is shown on datasheet note for use in a Tube, that offers Supplier Device Package features such as 54-SOIC.

Features

Tape & Reel (TR) Package
54-SOIC (0.295, 7.50mm Width) Exposed Pad package

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MPR111EKR2 Capacitive Sensors applications.

  • Proximity Sensor
  • Gesture Recognition
  • Automotive Door I Kick Sensors
  • Automotive Rain Sensor
  • Remote and Direct Liquid Level Sensor
  • High-resolution Metal Profling
  • Rain I Fog I Ice I Snow Sensor
  • Material Size Detection
  • Material Stack Height
  • Level Sensor for Liquids, including Conductive ones such as Detergent, Soap, and Ink
产品属性
全选
包装: 卷带(TR)
部件状态: 停产
可编程: 未验证
安装类型: 表面贴装型
封装/外壳: 54-SSOP(0.295",7.50mm 宽)裸露焊盘
供应商器件封装: 54-SOIC-EP
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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