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MPR084QR2

NXP MPR084QR2

按钮,滑块,拨轮是I²C1.8V ~ 3.6V-40°C ~ 85°C

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NXP USA Inc.
MPR084QR2
CONSUMER CIRCUIT, PQCC16
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价格更新:一个月前

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产品详情

Overview

The MPR083QR2 is IC CTLR TOUCH SENSOR PROX 16-QFN, that includes Buttons, Slider, Wheel Type, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 16-VQFN Exposed Pad, it has an Operating Temperature range of -40°C ~ 85°C, Interface is designed to work in I2C, as well as the 1.8 V ~ 3.6 V Voltage Supply, the device can also be used as 16-QFN-EP (5x5) Supplier Device Package. In addition, the Current Supply is 1.62mA, the device is offered in 8 Number of Inputs, the device has a Yes of Proximity Detection.

The MPR084Q is IC CTLR TOUCH SENSOR PROX 16-QFN, that includes 1.62mA Current Supply, they are designed to operate with a I2C Interface, Number of Inputs is shown on datasheet note for use in a 8, it has an Operating Temperature range of -40°C ~ 85°C, Package Case is designed to work in 16-VQFN Exposed Pad, as well as the Tray Packaging, the device can also be used as Yes Proximity Detection. In addition, the Supplier Device Package is 16-QFN-EP (5x5), the device is offered in Buttons, Slider, Wheel Type, the device has a 1.8 V ~ 3.6 V of Voltage Supply.

Features

Bulk Package
16-VQFN Exposed Pad package

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MPR084QR2 Capacitive Sensors applications.

  • Rain I Fog I Ice I Snow Sensor
  • Material Size Detection
  • Material Stack Height
  • Level Sensor for Liquids, including Conductive ones such as Detergent, Soap, and Ink
  • Collision Avoidance
  • Rain, Fog, Ice, Snow Sensor
  • Automotive Door and Kick Sensors
  • Compact Capacitive Keyboards
  • Remote Control Trackpads
  • Appliances
产品属性
全选
包装: 散装
部件状态: 停产
可编程: 未验证
类型: 按钮,滑块,拨轮
接近探测: 是
输入数: 8
接口: I²C
电源电压: 1.8V ~ 3.6V
电流 - 供电: 1.62mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
封装/外壳: 16-VQFN 裸露焊盘
供应商器件封装: 16-QFN-EP(5x5)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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