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MPL115A2T1

NXP MPL115A2T1

绝对I²C2.375V ~ 5.5V

比较
NXP USA Inc.
MPL115A2T1
SENSOR 16.68PSIA 10BIT 8LGA
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¥80.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The MPL115A2T1 is a simple barometer with digital output for cost-effective applications. It employs a MEMS pressure sensor with a conditioning integrated circuit to provide accurate pressure data. An integrated analog-to-digital converter (ADC) provides digitized temperature and pressure sensor outputs via either a serial peripheral interface (SPI) (MPL115A1) or I²C (MPL115A2) port. Calibration data is housed in on-board ROM, is used by the host microcontroller to apply compensation algorithms to the raw sensor data and may be accessed at any time. Calibration data is typically accessed when the host micro first enables the sensor. The MPL115A1 operates as a SPI slave with bus speeds up to 8 Mbps. The MPL115A2 operates as a I²C slave capable of bus speeds up to 400 Kbps (fast mode). Both versions are offered in a 5.0 mm x 3.0 mm x 1.2 mm max LGA package and are specified for operation from -40ºC to 105ºC. All packages are surface mount and RoHs compliant.

Features

Board Mount Applications
Moisture Sensitivity Level: 1 (Unlimited)
Package / Case: 8-TLGA
Operating Temperature: -40°C~105°C
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MPL115A2T1 Transducers applications.

  • Vertical velocity monitoring
  • Leisure, Sports, and Fitness Activity Identification
  • Weather Forecasting
  • Hydrogen Storage
  • Refrigerant pressure monitoring in HVAC/R systems
  • Dry air system pressure, process controls and automation
  • Dry air system monitoring
  • Hydraulic, brake, and engine oil fluid pressure monitoring
  • Air brake pressure monitoring
  • Vertical velocity indication (e.g. rise/sink speed)
产品属性
全选
包装: 卷带(TR)
部件状态: 停产
使用案例: 板式安装
压力类型: 绝对
工作压力: 7.25PSI ~ 16.68PSI(50kPa ~ 115kPa)
输出类型: I²C
输出: 10 b
精确度: ±0.145PSI(±1kPa)
电源电压: 2.375V ~ 5.5V
端口样式: 无端口
特性: 关断模式,待机模式
端接样式: SMD(SMT)接片
最高压力: 145.04PSI(1000kPa)
工作温度: -40°C ~ 105°C
安装类型: 表面贴装型
封装/外壳: 8-TLGA
供应商器件封装: 8-LGA(5x3)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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收入: 85M

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配件发货: 25M+

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