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MPC8572LVJAULE

NXP MPC8572LVJAULE

PowerPC e5001.333GHzDDR2,DDR310/100/1000Mbps(4)0°C ~ 105°C(TA)

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NXP USA Inc.
MPC8572LVJAULE
IC MPU MPC85XX 1.333GHZ 1023BGA
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产品详情

Overview

The MPC8572LPXAULD is IC MPU MPC85XX 1.333GHZ 1023BGA, that includes MPC85xx Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 1023-BFBGA, FCBGA, it has an Operating Temperature range of 0°C ~ 105°C (TA), Supplier Device Package is designed to work in 1023-FCPBGA (33x33), as well as the 1.5V, 1.8V, 2.5V, 3.3V Voltage I O, the device can also be used as 1.333GHz Speed. In addition, the Core Processor is PowerPC e500, the device is offered in 2 Core, 32-Bit Number of Cores Bus Width, the device has a Signal Processing; SPE of Co Processors DSP, and RAM Controllers is DDR2, DDR3, and the Graphics Acceleration is No, and Ethernet is 10/100/1000 Mbps (4).

The MPC8572LPXAVND is IC MPU MPC85XX 1.5GHZ 1023FCBGA, that includes Signal Processing; SPE Co Processors DSP, they are designed to operate with a PowerPC e500 Core Processor, Ethernet is shown on datasheet note for use in a 10/100/1000 Mbps (4), that offers Graphics Acceleration features such as No, Number of Cores Bus Width is designed to work in 2 Core, 32-Bit, it has an Operating Temperature range of 0°C ~ 105°C (TA), the device can also be used as 1023-BFBGA, FCBGA Package Case. In addition, the Packaging is Tray, the device is offered in DDR2, DDR3 RAM Controllers, the device has a MPC85xx of Series, and Speed is 1.5GHz, and the Supplier Device Package is 1023-FCPBGA (33x33), and Voltage I O is 1.5V, 1.8V, 2.5V, 3.3V.

Features

MPC85xx Series
PowerPC e500 Core

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MPC8572LVJAULE Microprocessor applications.

  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
产品属性
全选
型号系列: MPC85xx
包装: 托盘
部件状态: 停产
核心处理器: PowerPC e500
每总线宽度内核数: 2 核,32 位
速度: 1.333GHz
协处理器/数字信号处理器(DSP): 信号处理;SPE
RAM 控制器: DDR2,DDR3
图形加速: 无
以太网: 10/100/1000Mbps(4)
输入/输出电压: 1.5V,1.8V,2.5V,3.3V
工作温度: 0°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 1023-BBGA,FCBGA
供应商器件封装: 1023-FCPBGA(33x33)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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