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MPC8349ZUAJFB

NXP MPC8349ZUAJFB

PowerPC e300533MHzDDR,DDR210/100/1000Mbps(2)0°C ~ 105°C(TA)

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NXP USA Inc.
MPC8349ZUAJFB
IC MPU MPC83XX 533MHZ 672LBGA
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产品详情

Overview

The MPC8349ZUAJD is IC MPU MPC83XX 533MHZ 672TBGA, that includes MPC83xx Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 672-LBGA, it has an Operating Temperature range of 0°C ~ 105°C (TA), Supplier Device Package is designed to work in 672-TBGA (35x35), as well as the 1.8V, 2.5V, 3.3V Voltage I O, the device can also be used as 533MHz Speed. In addition, the Core Processor is PowerPC e300, the device is offered in 1 Core, 32-Bit Number of Cores Bus Width, the device has a DDR, DDR2 of RAM Controllers, and Graphics Acceleration is No, and the Ethernet is 10/100/1000 Mbps (2), and USB is USB 2.0 + PHY (2).

The MPC8349ZUAJF is IC MPU MPC83XX 533MHZ 672TBGA, that includes PowerPC e300 Core Processor, they are designed to operate with a 10/100/1000 Mbps (2) Ethernet, Graphics Acceleration is shown on datasheet note for use in a No, that offers Number of Cores Bus Width features such as 1 Core, 32-Bit, it has an Operating Temperature range of 0°C ~ 105°C (TA), as well as the 672-LBGA Package Case, the device can also be used as Tray Packaging. In addition, the RAM Controllers is DDR, DDR2, the device is offered in MPC83xx Series, the device has a 533MHz of Speed, and Supplier Device Package is 672-TBGA (35x35), and the USB is USB 2.0 + PHY (2), and Voltage I O is 1.8V, 2.5V, 3.3V.

Features

MPC83xx Series
PowerPC e300 Core

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MPC8349ZUAJFB Microprocessor applications.

  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
产品属性
全选
型号系列: MPC83xx
包装: 托盘
部件状态: 停产
核心处理器: PowerPC e300
每总线宽度内核数: 1 核,32 位
速度: 533MHz
RAM 控制器: DDR,DDR2
图形加速: 无
以太网: 10/100/1000Mbps(2)
USB(通用串行总线): USB 2.0 + PHY(2)
输入/输出电压: 1.8V,2.5V,3.3V
工作温度: 0°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 672-LBGA
供应商器件封装: 672-LBGA(35x35)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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