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MPC8260AVVPJDB

NXP MPC8260AVVPJDB

PowerPC G2300MHzDRAM,SDRAM10/100Mbps(3)0°C ~ 105°C(TA)

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NXP USA Inc.
MPC8260AVVPJDB
IC MPU MPC82XX 300MHZ 480TBGA
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产品详情

Overview

The MPC8260AVVPJDB PowerQUICC® II™ is an advanced integrated communications processor designed for the telecommunications and networking markets.

Like the MPC860, the MPC8260AVVPJDB integrates two main components, the embedded G2 core and the Communications Processor Module (CPM). This dual-processor architecture consumes less power than traditional architectures because the CPM offloads peripheral tasks from the embedded G2 core. The CPM simultaneously supports three fast serial communications controllers (FCCs), two multichannel controllers (MCCs), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the MPC8260, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.

Features

MPC82xx Series
PowerPC G2 Core

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MPC8260AVVPJDB Microprocessor applications.

  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
产品属性
全选
型号系列: MPC82xx
包装: 托盘
部件状态: 停产
核心处理器: PowerPC G2
每总线宽度内核数: 1 核,32 位
速度: 300MHz
协处理器/数字信号处理器(DSP): 通信;RISC CPM
RAM 控制器: DRAM,SDRAM
图形加速: 无
以太网: 10/100Mbps(3)
输入/输出电压: 3.3V
工作温度: 0°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 480-LBGA 裸露焊盘
供应商器件封装: 480-TBGA(37.5x37.5)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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