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MPC8250ACZUMHBC

NXP MPC8250ACZUMHBC

PowerPC G2266MHzDRAM,SDRAM10/100Mbps(3)-40°C ~ 105°C(TA)

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NXP USA Inc.
MPC8250ACZUMHBC
IC MPU MPC82XX 266MHZ 480TBGA
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产品详情

Overview

The PowerQUICC® II™ integrated communications processor family delivers excellent integration of processing power for networking and communications peripherals, providing customers with an innovative, total system solution for building high-end communications systems. NXP® Semiconductors's PowerQUICC II processor family is the next generation of the leading PowerQUICC™ line of integrated communications processors, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.

Our leading PowerQUICC architecture integrates two processing blocks. One block is a high-performance embedded G2 core and the second block is the Communications Processor Module (CPM). The CPM of the MPC8255 processor can support up to two fast serial communications controllers (FCCs), one multichannel controller (MCC), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I2C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the PowerQUICC II processor family, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.

Features

MPC82xx Series


300 MHz high-speed embedded G2 core

The powerful memory controller and system functions

Enhanced 32-bit RISC communications processor module

Up to two multiport 10/100 Mbps ethernet MAC

Up to two UTOPIA II ATM interfaces

Up to 128 HDLC channels (each channel 64 Kbps, full duplex)

Up to four 10 Mbps ethernet MAC



Surface Mount Mounting Type

Applications


Communications equipment 

Broadband fixed line access 

Enterprise systems 

Enterprise machine 

Personal electronics 

Portable electronics


产品属性
全选
型号系列: MPC82xx
包装: 托盘
部件状态: 停产
核心处理器: PowerPC G2
每总线宽度内核数: 1 核,32 位
速度: 266MHz
协处理器/数字信号处理器(DSP): 通信;RISC CPM
RAM 控制器: DRAM,SDRAM
图形加速: 无
以太网: 10/100Mbps(3)
输入/输出电压: 3.3V
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 480-LBGA 裸露焊盘
供应商器件封装: 480-TBGA(37.5x37.5)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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