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MMA9559LR1

NXP MMA9559LR1

数字±2g,4g,8gI²C,SPI

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NXP USA Inc.
MMA9559LR1
ACCELEROMETER 2-8G I2C/SPI 16LGA
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¥16.32

价格更新:一个月前

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产品详情

Overview

The MMA9555LR1 is ACCELEROMETER 2-8G I2C/SPI 16LGA, that includes Digital Type, they are designed to operate with a Reel Packaging, Unit Weight is shown on datasheet note for use in a 0.000695 oz, that offers Package Case features such as 16-VFLGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the Surface Mount Mounting Type, the device can also be used as I2C, SPI Output Type. In addition, the Features is Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor, the device is offered in 1.71 V ~ 1.89 V Voltage Supply, the device has a 16-LGA (3x3) of Supplier Device Package, and Axis is X, Y, Z, and the Acceleration Range is ±2g, 4g, 8g, and Sensitivity LSB g is 16393 (±2g) ~ 4098 (±8g), and the Bandwidth is 1.9Hz ~ 244Hz.

The MMA9559LKUBE is MMA9559L CUBE DEMOBOARD, that includes 2 g 4 g 8 g Acceleration, they are designed to operate with a Yes, MCU, 32-Bit Embedded, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, Packaging is designed to work in Bulk, as well as the Triple Sensing Axis, the device can also be used as ±2g, 4g, 8g Sensing Range. In addition, the Sensitivity is 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB, the device is offered in Accelerometer, 3 Axis Sensor Type, the device has a Board of Supplied Contents, and Tradename is Xtrinsic, and the Utilized IC Part is MMA9559L.

Features

Tape & Reel (TR) Package
X, Y, Z Axis
±2g, 4g, 8g Acceleration Range
16393 (±2g) ~ 4098 (±8g) Sensitivity (LSB/g)
0.12Hz ~ 1.95kHz Bandwidth
I²C, SPI Output Type
1.71V ~ 1.89V Voltage - Supply
Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor Features
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
类型: 数字
轴: X,Y,Z
加速度范围: ±2g,4g,8g
灵敏度,单位 LSB/g(重力): 16393(±2g)~ 4098(±8g)
频率范围: 0.12Hz ~ 1.95kHz
输出类型: I²C,SPI
电源电压: 1.71V ~ 1.89V
特性: 可调带宽,可选量程,睡眠模式,温度传感器
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 16-VFLGA
供应商器件封装: 16-LGA(3x3)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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