联系我们
中文
MK65FX1M0VMI18

NXP MK65FX1M0VMI18

ARM® Cortex®-M4180MHz1MB(1M x 8)

比较
NXP USA Inc.
MK65FX1M0VMI18
IC MCU 32BIT 1MB FLASH 169MAPBGA
paypalvisamastercarddiscover
upsdhlsf
比较

¥1840.00

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

MK65FN2M0VMI18 with pin details, that includes Kinetis K60 Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 169-LFBGA, it has an Operating Temperature range of -40°C ~ 105°C (TA), Supplier Device Package is designed to work in 169-MAPBGA (9x9), as well as the 116 Number of I O, the device can also be used as 180MHz Speed. In addition, the EEPROM Size is 4K x 8, the device is offered in ARMR CortexR-M4 Core Processor, the device has a 256K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is DMA, I2S, LVD, POR, PWM, WDT, and Connectivity is CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG, and the Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and Core Size is 32-Bit, and the Program Memory Size is 2MB (2M x 8), and Data Converters is A/D 2x16b, D/A 2x12b, and the Oscillator Type is Internal.

MK65FX1M0CAC18R with circuit diagram manufactured by NXP / Freescale. is part of the Embedded - Microcontrollers, , and with support for ARM Microcontrollers - MCU 1 MB Flash 180MHz Ethernet WLCSP 169, ARM? Cortex?-M4 Kinetis K60 Microcontroller IC 32-Bit 180MHz 1MB (1M x 8) FLASH 169-WLCSP (5.5x5.63), ARM? Cortex?-M0+ -based Kinetis Mini Microcontroller.

Features

Kinetis K60 Series
169-LFBGA package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MK65FX1M0VMI18 Microcontroller applications.

  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
产品属性
全选
型号系列: Kinetis K60
包装: 散装
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M4
内核规格: 32 位单核
速度: 180MHz
连接能力: CANbus,EBI/EMI,以太网,I²C,IrDA,SD,SPI,UART/USART,USB,SB OTG
外设: DMA,I²S,LVD,POR,PWM,WDT
输入/输出数量: 116
程序存储容量: 1MB(1M x 8)
程序存储器类型: 闪存
EEPROM 容量: 4K x 8
RAM 大小: 256K x 8
电源电压(Vcc/Vdd): 1.71V ~ 3.6V
数据转换器: A/D 2x16b; D/A 2x12b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 169-LFBGA
供应商器件封装: 169-MAPBGA(9x9)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z