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MK24FN256VDC12

NXP MK24FN256VDC12

ARM® Cortex®-M4120MHz256KB(256K x 8)

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NXP USA Inc.
MK24FN256VDC12
IC MCU 32BIT 256KB FLSH 121XFBGA
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¥139.50

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

MK24FN1M0VLL12R with pin details, that includes Kinetis K20 Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.024170 oz, that offers Package Case features such as 100-LQFP, it has an Operating Temperature range of -40°C ~ 105°C (TA), as well as the 100-LQFP (14x14) Supplier Device Package, the device can also be used as 66 Number of I O. In addition, the Speed is 120MHz, the device is offered in ARMR CortexR-M4 Core Processor, the device has a 256K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is DMA, I2S, LVD, POR, PWM, WDT, and Connectivity is CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG, and the Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and Core Size is 32-Bit, and the Program Memory Size is 1MB (1M x 8), and Data Converters is A/D 32x16b, D/A 2x12b, and the Oscillator Type is Internal.

MK24FN1M0VLQ12 with circuit diagram, that includes CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Connectivity, they are designed to operate with a ARMR CortexR-M4 Core Processor, Core Size is shown on datasheet note for use in a 32-Bit, that offers Data Converters features such as A/D 41x16b, D/A 2x12b, Number of I O is designed to work in 100, it has an Operating Temperature range of -40°C ~ 105°C (TA), the device can also be used as Internal Oscillator Type. In addition, the Package Case is 144-LQFP, the device is offered in Tray Alternate Packaging Packaging, the device has a DMA, I2S, LVD, POR, PWM, WDT of Peripherals, and Program Memory Size is 1MB (1M x 8), and the Program Memory Type is FLASH, and RAM Size is 256K x 8, and the Series is Kinetis K20, and Speed is 120MHz, and the Supplier Device Package is 144-LQFP (20x20), and Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V.

Features

Kinetis K20 Series


Communication interfaces

  • USB full-/low-speed On-the-Go controller

  • USB Device Charger detect (USBDCD)

  • Three SPI modules

  • Three I2C modules

  • Six UART modules

  • I2S module

Timers

  • Two 8-channel motor control/general purpose/PWM timers

  • Two 2-channel quadrature decoder/general purpose timers

  • Periodic interrupt timers and 16-bit low power timer

  • Carrier modulator transmitter

  • Real-time clock

  • Programmable delay block

Security and integrity modules

  • Hardware CRC module

  • 128-bit unique identification (ID) number per chip

Operating Characteristics

  • Voltage range: 1.71 to 3.6 V

  • Flash write voltage range: 1.71 to 3.6 V

  • Temperature range (ambient): –40 to 105 °C

Performance

  • Up to 120 MHz ARM? Cortex?-M4 core with DSP instructions and floating point unit

Memories and memory interfaces

  • Up to 256 KB program flash memory and 256 KB RAM

  • Serial programming interface (EzPort)

  • Pre-programmed Kinetis flashloader for one-time, insystem factory programming

System peripherals

  • Multiple low-power modes, low-leakage wakeup unit

  • 16-channel DMA controller

  • External watchdog monitor

  • Software watchdog

Clocks

  • 3 to 32 MHz and 32 kHz crystal oscillator

  • Multipurpose clock generator with FLL and PLL

  • 32 kHz, and 4 MHz internal reference clock

  • 48 MHz internal reference

Analog modules

  • Two 16-bit SAR ADCs

  • 12-bit DAC

  • Two analog comparators (CMP)

  • Voltage reference



Surface Mount Mounting Type

Applications


  • Automotive

  • Heating Ventilation, and Air Conditioning (HVAC)

  • Motorcycle Engine Control Unit (ECU) and Small Engine Control

  • Industrial

  • Air Conditioning (AC)

  • Anesthesia Unit Monitor

  • Blood Glucose Management

  • Continuous Positive Airway Pressure Machine (CPAP)

  • Defibrillator

  • Digital Stethoscope

  • Electricity Grid and Distribution

  • Energy Gateway

  • Gas Meter

  • Heart Monitors

  • Heat Metering

  • Home Health Gateway

  • Hospital Admission Machine

  • Industrial HMI

  • Medical Imaging

  • Motor Drives

  • Powered Patient Beds

  • Smart Power Socket and Light Switch

  • Surround View

  • Vital Signs Monitors

  • Water Meter

  • Mobile

  • Hearables

  • Input Device (Mouse, Pen, Keyboard)

  • Smart Watch

  • Wristband

  • Smart City

  • Automatic Vehicle Identification

  • POS Terminal

  • Transport Ticketing

  • Smart Home

  • Major Home Appliances

  • Robotic Appliance

  • Small and Medium Appliances


产品属性
全选
型号系列: Kinetis K20
包装: 托盘
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M4
内核规格: 32 位单核
速度: 120MHz
连接能力: I²C,SPI,UART/USART,USB OTG
外设: DMA,I²S,LVD,POR,PWM,WDT
输入/输出数量: 83
程序存储容量: 256KB(256K x 8)
程序存储器类型: 闪存
RAM 大小: 256K x 8
电源电压(Vcc/Vdd): 1.71V ~ 3.6V
数据转换器: A/D 37x16b; D/A 2x12b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 121-XFBGA
供应商器件封装: 121-XFBGA(8x8)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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