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MK22FN512VDC12R

NXP MK22FN512VDC12R

ARM® Cortex®-M4120MHz512KB(512K x 8)

比较
NXP USA Inc.
MK22FN512VDC12R
IC MCU 32BIT 512KB FLSH 121XFBGA
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比较

¥273.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

MK22FN512CAP12R with pin details, that includes Kinetis K20 Series, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 80-UFBGA, WLCSP, it has an Operating Temperature range of -40°C ~ 85°C (TA), Supplier Device Package is designed to work in 80-WLCSP (4.13x3.56), as well as the 52 Number of I O, the device can also be used as 120MHz Speed. In addition, the Core Processor is ARMR CortexR-M4, the device is offered in 128K x 8 RAM Size, the device has a FLASH of Program Memory Type, and Peripherals is DMA, I2S, LVD, POR, PWM, WDT, and the Connectivity is I2C, IrDA, SPI, UART/USART, USB, USB OTG, and Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and the Core Size is 32-Bit, and Program Memory Size is 512KB (512K x 8), and the Data Converters is A/D 2x16b, D/A 2x12b, and Oscillator Type is Internal.

MK22FN512CBP12R with EDA / CAD Models manufactured by NXP / Freescale. is part of the Embedded - Microcontrollers, , and with support for "ARM Microcontrollers - MCU Kinetis K 32-bit, ARM? Cortex?-M4 Kinetis K20 Microcontroller IC 32-Bit 120MHz 512KB (512K x 8) FLASH, MCU 32-bit ARM Cortex M4 RISC 512KB Flash 3.3V T/R, ARM Microcontrollers - MCU Kinetis K 32-bit, ARM Cortex-M4 core, 512KB Flash, 120MHz, USB, Thin 80WLCSP.

Features

Kinetis K20 Series
121-XFBGA package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MK22FN512VDC12R Microcontroller applications.

  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products
  • Digital cameras
  • DVD\DV\MP3 players
产品属性
全选
型号系列: Kinetis K20
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M4
内核规格: 32 位单核
速度: 120MHz
连接能力: I²C,IrDA,SPI,UART/USART,USB,USB OTG
外设: DMA,I²S,LVD,POR,PWM,WDT
输入/输出数量: 81
程序存储容量: 512KB(512K x 8)
程序存储器类型: 闪存
RAM 大小: 128K x 8
电源电压(Vcc/Vdd): 1.71V ~ 3.6V
数据转换器: A/D 38x16b; D/A 2x12b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 121-XFBGA
供应商器件封装: 121-XFBGA(8x8)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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