联系我们
中文
MK22FN1M0VLK12

NXP MK22FN1M0VLK12

ARM® Cortex®-M4120MHz1MB(1M x 8)

比较
NXP USA Inc.
MK22FN1M0VLK12
IC MCU 32BIT 1MB FLASH 80FQFP
无数据表
paypalvisamastercarddiscover
upsdhlsf
比较

¥79.25

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

The MK22FN1M0VLH12 is IC MCU 32BIT 1MB FLASH 64LQFP, that includes Kinetis K20 Series, they are designed to operate with a Tray Packaging, Unit Weight is shown on datasheet note for use in a 0.012224 oz, that offers Mounting Style features such as SMD/SMT, Tradename is designed to work in Kinetis, as well as the 64-LQFP Package Case, it has an Operating Temperature range of -40°C ~ 105°C (TA). In addition, the Supplier Device Package is 64-LQFP (10x10), the device is offered in 40 Number of I O, the device has a 120MHz of Speed, and Core Processor is ARMR CortexR-M4, and the RAM Size is 128K x 8, and Program Memory Type is FLASH, and the Peripherals is DMA, I2S, LVD, POR, PWM, WDT, and Connectivity is CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG, and the Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and Core Size is 32-Bit, and the Program Memory Size is 1MB (1M x 8), and Data Converters is A/D 22x16b, D/A 1x12b, and the Oscillator Type is Internal, it has an Maximum Operating Temperature range of + 105 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Voltage is 1.71 V to 3.6 V, and the Interface Type is CAN I2C I2S SPI UART USB, and Core is ARM Cortex M4, and the Processor Series is Kinetis, and Data Bus Width is 32 bit, and the Maximum Clock Frequency is 120 MHz, and Number of ADC Channels is 2, and the Data RAM Size is 128 kB, and Number of Timers Counters is 6 Timer, and the ADC Resolution is 12 bit, and Data RAM Type is SRAM.

MK22FN1M0AVMC12 with EDA / CAD Models, that includes Tray Packaging, they are designed to operate with a Kinetis K20 Series, Oscillator Type is shown on datasheet note for use in a Internal, that offers Program Memory Type features such as FLASH, Peripherals is designed to work in DMA, I2S, LVD, POR, PWM, WDT, as well as the CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Connectivity, the device can also be used as ARMR CortexR-M4 Core Processor. In addition, the Data Converters is A/D 38x16b, D/A 2x12b, the device is offered in 64 Number of I O, it has an Operating Temperature range of -40°C ~ 105°C (TA), and Core Size is 32-Bit, and the Program Memory Size is 1MB (1M x 8), and RAM Size is 128K x 8, and the Supplier Device Package is 121-MAPBGA (8x8), and Package Case is 121-LFBGA, and the Speed is 120MHz, and Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V.

Features

Kinetis K20 Series


  • Real-time clock

  • Voltage reference

  • Hardware CRC module

  • Programmable delay block

  • USB device charger detect

  • 16-channel DMA controller

  • FlexBus external bus interface

  • Carrier modulator transmitter

  • Three analog comparators (CMP)

  • Controller area network (CAN) module

  • Secure digital host controller (SDHC)

  • USB Full-/low-speed On-the-Go controller

  • Two 8-channel Flex-timers (PWM/motor control)

  • Two 2-channel Flex-timers (PWM/quad decoder)

  • 128-bit Unique identification (ID) number per chip

  • External watchdog monitor and software watchdog

  • Periodic interrupt timers and 16-bit Low-power timer

  • Multiple low-power modes - low leakage wakeup unit

  • Memory protection unit with multi-master protection

  • ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz



Surface Mount Mounting Type

Applications


  • Industrial

  • Automation & Process Control


产品属性
全选
型号系列: Kinetis K20
包装: 托盘
部件状态: 不适用于新设计
可编程: 未验证
核心处理器: ARM® Cortex®-M4
内核规格: 32 位单核
速度: 120MHz
连接能力: CANbus,EBI/EMI,I²C,IrDA,SPI,UART/USART,USB,USB OTG
外设: DMA,I²S,LVD,POR,PWM,WDT
输入/输出数量: 56
程序存储容量: 1MB(1M x 8)
程序存储器类型: 闪存
RAM 大小: 128K x 8
电源电压(Vcc/Vdd): 1.71V ~ 3.6V
数据转换器: A/D 27x16b; D/A 1x12b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 80-LQFP
供应商器件封装: 80-FQFP(12x12)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z