NXP MGD3160AM535EKT

高端14.5V ~ 40V

Overview

160-10-312-00-001101 with pin details, that includes Black Color, they are designed to operate with a 160 Series, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the DIP, DIL - Header Connector Type, the device can also be used as Gold Contact Finish. In addition, the Contact Finish Thickness is 10μin (0.25μm), the device is offered in 12 Number of Positions, the device has a 0.100" (2.54mm) of Pitch, and Number of Rows is 2, and the Contact Type is Slotted, and Row Spacing is 0.300" (7.62mm).

The 160-10-314-00-001101 is DIL SOLDER TAIL 2.54MM, that includes Black Color, they are designed to operate with a DIP, DIL - Header Connector Type, Contact Finish is shown on datasheet note for use in a Gold, that offers Contact Finish Thickness features such as 10μin (0.25μm), Contact Type is designed to work in Slotted, as well as the Through Hole Mounting Type, the device can also be used as 14 Number of Positions. In addition, the Number of Rows is 2, the device is offered in Bulk Packaging, the device has a 0.100" (2.54mm) of Pitch, and Row Spacing is 0.300" (7.62mm), and the Series is 160, and Termination is Solder.

Features

Tray Package
Single Channel Type
1 Number of Drivers
IGBT, SiC MOSFET Gate Type
4.5V ~ 40V Voltage - Supply
15A, 15A Current - Peak Output (Source, Sink)
Surface Mount Mounting Type