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MCZ33903CP3EK

NXP MCZ33903CP3EK

系统基础芯片CAN5.5V ~ 28V表面贴装型

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NXP USA Inc.
MCZ33903CP3EK
SYSTEM BASIS CHIP, 2X 3.3 V/400M
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¥45.53

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The MCZ33903CD5EK is IC SBC CAN HS 5.0V 32SOIC, that includes MC33903 Series, they are designed to operate with a System Basis Chips Product, Type is shown on datasheet note for use in a System Basis Chip/CAN Transceiver, that offers Packaging features such as Tube Alternate Packaging, Unit Weight is designed to work in 0.016649 oz, as well as the SMD/SMT Mounting Style, the device can also be used as 32-SSOP (0.295", 7.50mm Width) Exposed Pad Package Case. In addition, the Mounting Type is Surface Mount, the device is offered in System Basis Chip Applications, the device has a CAN, LIN of Interface, and Voltage Supply is 5.5 V ~ 28 V, and the Supplier Device Package is 32-SOIC Exposed Pad, and Operating Supply Voltage is 3.3 V 5 V, and the Operating Supply Current is 4 mA, and Protocol Supported is CAN LIN, and the Supply Voltage Max is 5 V, and Supply Voltage Min is 3.3 V.

The MCZ33903CD5EKR2 is IC SBC CAN HS 5.0V 32SOIC, that includes System Basis Chip Applications, they are designed to operate with a CAN, LIN Interface, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Package Case features such as 32-SSOP (0.295", 7.50mm Width) Exposed Pad, Packaging is designed to work in Tape & Reel (TR) Alternate Packaging, as well as the CAN LIN Protocol Supported, the device can also be used as MC33903 Series. In addition, the Supplier Device Package is 32-SOIC Exposed Pad, the device is offered in 0.016649 oz Unit Weight, the device has a 5.5 V ~ 28 V of Voltage Supply.

Features

Bulk Package
It is based on MCZ33903.
Set the part at 10.5V volts
Other Analog IC Type : POWER SUPPLY MANAGEMENT CIRCUIT

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MCZ33903CP3EK Specialized Interface ICs applications.

  • Transmit and
  • Low-Voltage
  • Isolation
  • Medical/Industrial
  • Imaging
  • Ultrasound
  • Audio and video switching
  • Automatic test equipment
  • Precision data acquisition
  • Battery-powered systems
产品属性
全选
包装: 散装
部件状态: 在售
使用案例: 系统基础芯片
接口: CAN
电源电压: 5.5V ~ 28V
封装/外壳: 32-SSOP(0.295",7.50mm 宽)裸露焊盘
供应商器件封装: 32-SOIC-EP
安装类型: 表面贴装型
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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收入: 85M

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配件发货: 25M+

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