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MCIMX7D3DVK10SC

NXP MCIMX7D3DVK10SC

ARM® Cortex®-A7,ARM® Cortex®-M41.0GHzLPDDR2,LPDDR3,DDR3,DDR3L10/100/1000Mbps(2)0°C ~ 95°C(TJ)

比较
NXP USA Inc.
MCIMX7D3DVK10SC
IC MPU I.MX7D 1.0GHZ 488TFBGA
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比较

¥147.93

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

MCIMX6X4CVM08AB with pin details, that includes i.MX6SX Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 529-LFBGA, it has an Operating Temperature range of -40°C ~ 105°C (TA), Supplier Device Package is designed to work in 529-MAPBGA (19x19), as well as the 1.8V, 2.5V, 2.8V, 3.15V Voltage I O, the device can also be used as 200MHz, 800MHz Speed. In addition, the Core Processor is ARMR CortexR-A9, ARMR CortexR-M4, the device is offered in 2 Core, 32-Bit Number of Cores Bus Width, the device has a Multimedia; NEON? MPE of Co Processors DSP, and RAM Controllers is LPDDR2, LVDDR3, DDR3, and the Graphics Acceleration is Yes, and Display & Interface Controllers is Keypad, LCD, LVDS, and the Ethernet is 10/100/1000 Mbps (2), and USB is USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2), and the Security Features is A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE.

MCIMX6Y2DVM05AA with circuit diagram manufactured by NXP. The MCIMX6Y2DVM05AA is available in BGA Package, is part of the IC Chips, ARM? Cortex?-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 528MHz 289-MAPBGA (14x14), SOC i.MX 6ULL ARM Cortex M7 CMOS 289-Pin MAP-BGA Tray.

Features

i.MX7D Series
ARM® Cortex®-A7, ARM® Cortex®-M4 Core

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MCIMX7D3DVK10SC Microprocessor applications.

  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
产品属性
全选
型号系列: i.MX7D
包装: 托盘
部件状态: 不适用于新设计
核心处理器: ARM® Cortex®-A7,ARM® Cortex®-M4
每总线宽度内核数: 2 核,32 位
速度: 1.0GHz
协处理器/数字信号处理器(DSP): 多媒体;NEON™ MPE
内存控制器: LPDDR2,LPDDR3,DDR3,DDR3L
图形加速: 无
显示器和界面控制器: 小键盘,LCD,MIPI
以太网: 10/100/1000Mbps(2)
USB(通用串行总线): USB 2.0 + PHY(1),USB 2.0 OTG + PHY(2)
输入/输出电压: 1.8V,3.3V
工作温度: 0°C ~ 95°C(TJ)
安全功能: A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS
安装类型: 表面贴装型
包装 / 盒: 488-TFBGA
供应商 设备封装: 488-TFBGA(12x12)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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