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MCIMX6X1AVO08AC

NXP MCIMX6X1AVO08AC

ARM® Cortex®-A9,ARM® Cortex®-M4200MHz,800MHzLPDDR2,LVDDR3,DDR310/100/1000Mbps(2)-40°C ~ 125°C(TJ)

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NXP USA Inc.
MCIMX6X1AVO08AC
IC MPU I.MX6SX 800MHZ 400MAPBGA
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¥297.00

价格更新:一个月前

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产品详情

Overview

MCIMX6X1AVK08AB with pin details, that includes i.MX6SX Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 400-LFBGA, it has an Operating Temperature range of -40°C ~ 125°C (TJ), Supplier Device Package is designed to work in 400-MAPBGA (14x14), as well as the 1.8V, 2.5V, 2.8V, 3.15V Voltage I O, the device can also be used as 200MHz, 800MHz Speed. In addition, the Core Processor is ARMR CortexR-A9, ARMR CortexR-M4, the device is offered in 2 Core, 32-Bit Number of Cores Bus Width, the device has a Multimedia; NEON? MPE of Co Processors DSP, and RAM Controllers is LPDDR2, LVDDR3, DDR3, and the Graphics Acceleration is No, and Display & Interface Controllers is Keypad, LCD, and the Ethernet is 10/100/1000 Mbps (2), and USB is USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2), and the Security Features is A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE.

MCIMX6UL-EVKB with EDA / CAD Models, that includes MPU Type, they are designed to operate with a i.MX 6UltraLite For Use With Related Products, Series is shown on datasheet note for use in a i.MX, that offers Mounting Type features such as Fixed, Board Type is designed to work in Evaluation Platform, as well as the Board(s), Cable(s), Power Supply, Accessories Contents, the device can also be used as ARMR CortexR-A7 Core Processor.

Features

i.MX6SX Series
Tray Package
200MHz, 800MHz Speed
Multimedia; NEON™ MPE Co-Processors/DSP
LPDDR2, LVDDR3, DDR3 RAM Controllers
No Graphics Acceleration
Keypad, LCD Display & Interface Controllers
10/100/1000Mbps (2) Ethernet
USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) USB
1.8V, 2.5V, 2.8V, 3.15V Voltage - I/O
Surface Mount Mounting Type
产品属性
全选
型号系列: i.MX6SX
包装: 托盘
部件状态: 在售
核心处理器: ARM® Cortex®-A9,ARM® Cortex®-M4
每总线宽度内核数: 2 核,32 位
速度: 200MHz,800MHz
协处理器/数字信号处理器(DSP): 多媒体;NEON™ MPE
RAM 控制器: LPDDR2,LVDDR3,DDR3
图形加速: 无
显示与接口控制器: 小键盘,LCD
以太网: 10/100/1000Mbps(2)
USB(通用串行总线): USB 2.0 + PHY(1),USB 2.0 OTG + PHY(2)
输入/输出电压: 1.8V,2.5V,2.8V,3.15V
工作温度: -40°C ~ 125°C(TJ)
安全特性: A-HAB,ARM TZ,CAAM,CSU,SNVS,系统 JTAG,TVDECODE
安装类型: 表面贴装型
封装/外壳: 400-LFBGA
供应商器件封装: 400-MAPBGA(17x17)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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