NXP MCIMX6G0DVM05AA

ARM® Cortex®-A7528MHzLPDDR2，DDR3，DDR3L10/100Mbps（1）0°C ~ 95°C（TJ）

Overview

The MCIMX6DP6AVT1AA is 21X21 .8MM PITCH LIDDED, that includes i.MX6DP Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 624-FBGA, FCBGA, it has an Operating Temperature range of -40°C ~ 125°C (TJ), Supplier Device Package is designed to work in 624-FCBGA (21x21), as well as the 1.8V, 2.5V, 2.8V, 3.3V Voltage I O, the device can also be used as 1.0GHz Speed. In addition, the Core Processor is ARMR CortexR-A9, the device is offered in 2 Core, 32-Bit Number of Cores Bus Width, the device has a Multimedia; NEON? SIMD of Co Processors DSP, and RAM Controllers is LPDDR2, DDR3L, DDR3, and the Graphics Acceleration is Yes, and Display & Interface Controllers is HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel, and the Ethernet is 10/100/1000 Mbps (1), and SATA is SATA 3Gbps (1), and the USB is USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1), and Security Features is ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS.

The MCIMX6DP7CVT8AA is 21X21 .8MM PITCH LIDDED, that includes Multimedia; NEON? SIMD Co Processors DSP, they are designed to operate with a ARMR CortexR-A9 Core Processor, Display & Interface Controllers is shown on datasheet note for use in a HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel, that offers Ethernet features such as 10/100/1000 Mbps (1), Graphics Acceleration is designed to work in Yes, as well as the 2 Core, 32-Bit Number of Cores Bus Width, it has an Operating Temperature range of -40°C ~ 105°C (TA). In addition, the Package Case is 624-FBGA, FCBGA, the device is offered in Tray Packaging, the device has a LPDDR2, DDR3L, DDR3 of RAM Controllers, and SATA is SATA 3Gbps (1), and the Security Features is ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS, and Series is i.MX6DP, and the Speed is 800MHz, and Supplier Device Package is 624-FCBGA (21x21), and the USB is USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1), and Voltage I O is 1.8V, 2.5V, 2.8V, 3.3V.

Features

Single-core ARM Cortex-A7—The single-core A7 provides a cost-effective and power-efficient solution.

Multilevel memory system—The multilevel memory system of each device is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The device supports many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including eMMC up to rev 4.4/4.41/4.5.

Smart speed technology—Power management implemented throughout the IC that enables multimedia features and peripherals to consume minimum power in both active and various low power modes. 

Dynamic voltage and frequency scaling—The processor improve the power efficiency by scaling the voltage and frequency to optimize performance.

Multimedia powerhouse—Multimedia performance is enhanced by a multilevel cache system, NEON? MPE (Media Processor Engine) co-processor, a programmable smart DMA (SDMA) controller, an asynchronous audio sample rate converter, and a Pixel processing pipeline (PXP) to support 2D image processing, including color-space conversion, scaling, alpha-blending, and rotation.

Ethernet interfaces—10/100 Mbps Ethernet controllers.

Human-machine interface—Support digital parallel display interface

Applications

Electronics Point-of-Sale device

Telematics

IoT Gateway

Access control panels

Human Machine Interfaces (HMI)

Smart appliances