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MC9S08GT60CFB

NXP MC9S08GT60CFB

S0840MHz60KB(60K x 8)

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NXP USA Inc.
MC9S08GT60CFB
IC MCU 8BIT 60KB FLASH 44QFP
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¥52.00

价格更新:一个月前

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产品详情

Overview

 Features Features have been organized to reflect: · Standard features of the HCS08 Family · Features of the MC9S08GB/GTMCU  Standard Features of the HCSO8 Family ·40-MHz HCSO8 CPU(central processor unit) · HCO8 instruction set with added BGND instruction · Background debugging system(see also Chapter 15,"Development Support") · Breakpoint capability to allow single breakpoint setting during in-circuit debugging(plus two more breakpoints in on-chip debug module) · Debug module containing two comparators and nine trigger modes. Eight deep FIFO for storing change-of-flow addresses and event-only data. Debug module supports both tag and force breakpoints. Support for up to 32 interrupt/reset sources · Power-saving modes: wait plus three stops · System protection features: -Optional computer operating properly (COP) reset -Low-voltage detection with reset or interupt — Illegal opcode detection with reset -Illegal address detection with reset(some devices don't have illegal addresses)  Features of MC9S08GB/GT Series of MCUs · On-chip in-circuit programmable FLASH memory with block protection and security options (see Table 1-1 for device specific information) · On-chip random-access memory (RAM)(see Table 1-1 for device specific information) ·8-channel,10-bit analog-to-digital converter(ATD) · Two serial communications interface modules(SCI) · Serial peripheral interface module(SPI)

Features

S08 Series


  • Package: QFP44

  • Package/Case: 44-QFP

  • Device Package: 44-QFP (10x10)

  • RoHS: Lead free / RoHS Compliant



Surface Mount Mounting Type

Applications


  • Industrial

  • Automotive

  • Communications equipment


产品属性
全选
型号系列: S08
包装: 托盘
部件状态: 停产
可编程: 未验证
核心处理器: S08
内核规格: 8 位
速度: 40MHz
连接能力: I²C,SCI,SPI
外设: LVD,POR,PWM,WDT
输入/输出数量: 36
程序存储容量: 60KB(60K x 8)
程序存储器类型: 闪存
RAM 大小: 4K x 8
电源电压(Vcc/Vdd): 1.8V ~ 3.6V
数据转换器: A/D 8x10b
振荡器类型: 内部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 44-QFP
供应商器件封装: 44-QFP(10x10)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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