NXP MC9S08GT60ACFBER

Overview

The MC9S08GT60ACFBE is IC MCU 8BIT 60KB FLASH 44QFP, that includes S08 Series, they are designed to operate with a MCU Product, Packaging is shown on datasheet note for use in a Tray Alternate Packaging, that offers Unit Weight features such as 0.017588 oz, Mounting Style is designed to work in SMD/SMT, as well as the 44-QFP Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Supplier Device Package is 44-QFP (10x10), the device is offered in 36 Number of I O, the device has a 40MHz of Speed, and Core Processor is S08, and the RAM Size is 4K x 8, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is I2C, SCI, SPI, and the Voltage Supply Vcc Vdd is 1.8 V ~ 3.6 V, and Core Size is 8-Bit, and the Program Memory Size is 60KB (60K x 8), and Data Converters is A/D 8x10b, and the Oscillator Type is Internal, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Voltage is 1.8 V to 3.6 V, and the Interface Type is I2C SCI SPI, and Core is HCS08, and the Processor Series is MC9S08GT60A, and Data Bus Width is 8 bit, and the Supply Voltage Max is 3.6 V, and Supply Voltage Min is 1.8 V 2.08 V, and the Maximum Clock Frequency is 40 MHz, and Number of ADC Channels is 8, and the Number of I Os is 39 I/O, and Data RAM Size is 4 kB, and the Number of Timers Counters is 2 Timer, and ADC Resolution is 10 bit, and the Data ROM Type is Flash.

The MC9S08GT60ACBE is IC MCU 8BIT 60KB FLASH 42PSDIP, that includes I2C, SCI, SPI Connectivity, they are designed to operate with a Core Processor, Core Size is shown on datasheet note for use in a 8-Bit, that offers Data Converters features such as A/D 8x10b, Number of I O is designed to work in 33, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as Internal Oscillator Type. In addition, the Package Case is 42-SDIP (0.600", 15.24mm), the device is offered in Tube Packaging, the device has a LVD, POR, PWM, WDT of Peripherals, and Program Memory Size is 60KB (60K x 8), and the Program Memory Type is FLASH, and RAM Size is 4K x 8, and the Series is S08, and Speed is 40MHz, and the Supplier Device Package is 42-PSDIP, and Voltage Supply Vcc Vdd is 1.8 V ~ 3.6 V.

Features

• 40-MHz HCS08 CPU (central processor unit)

• HC08 instruction set with added BGND instruction

• Breakpoint capability to allow a single breakpoint setting during in-circuit debugging (plus two more breakpoints in the on-chip debug module)

• Debug module containing two comparators and nine trigger modes. Eight deep FIFO for storing change-of-flow addresses and event-only data. Debug module supports both tag and force breakpoints.

• Support for up to 32 interrupt/reset sources

• Power-saving modes: wait plus three stops

• Breakpoint capability to allow a single breakpoint setting during in-circuit debugging (plus two more breakpoints in the on-chip debug module)

• Inter-integrated circuit bus module to operate up to 100 kbps (IIC) 

• One 3-channel and one 5-channel 16-bit timer/pulse width modulator (TPM) modules with selectable input capture, output compare, and edge-aligned PWM capability on each channel. Each timer module may be configured for buffered, centred PWM (CPWM) on all channels (TPMx).

• 8-pin keyboard interrupt module (KBI)

• 16 high-current pins (limited by package dissipation)

• Software selectable pullups on ports when used as input. Selection is on an individual port bit basis. During output mode, pullups are disengaged

Applications

• General Use