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MC9S08DZ60AMLC

NXP MC9S08DZ60AMLC

S0840MHz60KB(60K x 8)

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NXP USA Inc.
MC9S08DZ60AMLC
IC MCU 8BIT 60KB FLASH 32LQFP
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¥282.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The MC9S08DZ60ACLH is IC MCU 8BIT 60KB FLASH 64LQFP, that includes S08 Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 64-LQFP, it has an Operating Temperature range of -40°C ~ 85°C (TA), Supplier Device Package is designed to work in 64-LQFP (10x10), as well as the 53 Number of I O, the device can also be used as 40MHz Speed. In addition, the EEPROM Size is 2K x 8, the device is offered in S08 Core Processor, the device has a 4K x 8 of RAM Size, and Program Memory Type is FLASH, and the Peripherals is LVD, POR, PWM, WDT, and Connectivity is CAN, I2C, LIN, SCI, SPI, and the Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V, and Core Size is 8-Bit, and the Program Memory Size is 60KB (60K x 8), and Data Converters is A/D 24x12b, and the Oscillator Type is External.

The MC9S08DZ60ACLF is IC MCU 8BIT 60KB FLASH 48LQFP, that includes CAN, I2C, LIN, SCI, SPI Connectivity, they are designed to operate with a S08 Core Processor, Core Size is shown on datasheet note for use in a 8-Bit, that offers Data Converters features such as A/D 16x12b, EEPROM Size is designed to work in 2K x 8, as well as the 39 Number of I O, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Oscillator Type is External, the device is offered in 48-LQFP Package Case, the device has a Tray of Packaging, and Peripherals is LVD, POR, PWM, WDT, and the Program Memory Size is 60KB (60K x 8), and Program Memory Type is FLASH, and the RAM Size is 4K x 8, and Series is S08, and the Speed is 40MHz, and Supplier Device Package is 48-LQFP (7x7), and the Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V.

Features

S08 Series
  • Two very low-power stop modes

  • Reduced power wait mode

  • HC08 Instruction set with added BGND instruction

  • Support for up to 32 Interrupt/reset sources

  • Very low power real-time interrupt for use in the run, wait and stop

  • Loop-control Pierce oscillator (XOSC)

  • Multi-purpose clock generator (MCG)

  • Watchdog computer operating properly (COP) reset

  • Low-voltage detection with reset or interrupt - selectable trip points

  • Illegal opcode detection with reset

  • Illegal address detection with reset

  • Flash block protect

  • Loss-of-lock protection

  • Single-wire background debug interface

  • On-chip, in-circuit emulation (ICE) with real-time bus capture

  • MSCAN - CAN protocol version 2.0 A, B

  • Two SCIs supporting LIN 2.0 protocol and SAE J2602 protocols

  • 24 Interrupt pins with selectable polarity on each pin

  • Hysteresis and configurable pull device on all input pins

  • Configurable slew rate and drive strength on all output pins

Surface Mount Mounting Type

Applications

MC9S08DZ60AMLC Applications

There are a lot of NXP USA Inc. MC9S08DZ60AMLC Microcontroller applications. MC9S08DZ60AMLC MCU is usually applied for Measurement and control field, Consumer electronics products, Network communication, mobile communication, Office automation equipment and computer peripherals, Industrial control Instrumentation and process control, Agriculture, transportation, Navigation control, Network application, Metering & measurement, Day to day life, Safety, Medical instruments and Automobile industry.

  • Telephone sets

  • Automatic staplers

  • Medical instruments chromatographs

  • Communication

  • Torpedo guidance

  • Digital TVs

  • Electrocardiogram (EKG)

  • Fire detection & safety devices

  • Food and beverage

  • Switches

产品属性
全选
型号系列: S08
包装: 散装
部件状态: 在售
可编程: 未验证
核心处理器: S08
内核规格: 8 位
速度: 40MHz
连接能力: CANbus,I²C,LIN,SCI,SPI
外设: LVD,POR,PWM,WDT
输入/输出数量: 25
程序存储容量: 60KB(60K x 8)
程序存储器类型: 闪存
EEPROM 容量: 2K x 8
RAM 大小: 4K x 8
电源电压(Vcc/Vdd): 2.7V ~ 5.5V
数据转换器: A/D 10x12b
振荡器类型: 外部
工作温度: -40°C ~ 125°C(TA)
安装类型: 表面贴装型
封装/外壳: 32-LQFP
供应商器件封装: 32-LQFP(7x7)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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