
NXP MC9328MX1DVM15R2518
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Overview
The MC9328MX1CVM15R2 is IC MPU I.MX1 150MHZ 256MAPBGA, that includes i.MX1 Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.017789 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 256-MAPBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as 1.8V, 3.0V Voltage I O. In addition, the Speed is 150MHz, the device is offered in ARM920T Core Processor, the device has a 1 Core, 32-Bit of Number of Cores Bus Width, and RAM Controllers is SDRAM, and the Graphics Acceleration is No, and Display & Interface Controllers is LCD, Touch Panel, and the USB is USB 1.x (1), and Number of Cores is 1 Core, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 1.8 V, and Application is Multimedia Applications, and the Interface Type is I2C SPI SSI UART USB, and Core is ARM920TDMI, and the Processor Series is i.MX1, and Data Bus Width is 32 bit, and the Maximum Clock Frequency is 150 MHz, and I O Voltage is 1.7 V to 3.3 V, and the Number of Timers Counters is 2 x 32 bit, and Watchdog Timers is Watchdog Timer.
The MC9328MX1DVH20 is IC MPU I.MX1 200MHZ 256MAPBGA, that includes ARM920T Core Processor, they are designed to operate with a LCD, Touch Panel Display & Interface Controllers, Graphics Acceleration is shown on datasheet note for use in a No, that offers Number of Cores Bus Width features such as 1 Core, 32-Bit, it has an Operating Temperature range of -30°C ~ 70°C (TA), as well as the 256-LFBGA Package Case, the device can also be used as Tray Packaging. In addition, the RAM Controllers is SDRAM, the device is offered in i.MX1 Series, the device has a 200MHz of Speed, and USB is USB 1.x (1), and the Voltage I O is 1.8V, 3.0V.
Features
Bulk Package- 起步价为$40,南非、巴西、印度、巴基斯坦、以色列等国家的价格会有所变动,详情请咨询相关客服人员。
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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