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MC68306AG16B

NXP MC68306AG16B

EC00016MHzDRAM0°C ~ 70°C(TA)

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NXP USA Inc.
MC68306AG16B
IC MPU M683XX 16MHZ 144LQFP
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¥166.36

价格更新:一个月前

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产品详情

Overview

The MC68302RC16C is IC MPU M683XX 16MHZ 132PGA, that includes M683xx Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 132-BEPGA, it has an Operating Temperature range of 0°C ~ 70°C (TA), Supplier Device Package is designed to work in 132-PGA (34.5x34.5), as well as the 5.0V Voltage I O, the device can also be used as 16MHz Speed. In addition, the Core Processor is M68000, the device is offered in 1 Core, 8/16-Bit Number of Cores Bus Width, the device has a Communications; RISC CPM of Co Processors DSP, and RAM Controllers is DRAM, and the Graphics Acceleration is No.

The MC68302RC25C is IC MPU M683XX 25MHZ 132PGA, that includes Communications; RISC CPM Co Processors DSP, they are designed to operate with a M68000 Core Processor, Graphics Acceleration is shown on datasheet note for use in a No, that offers Number of Cores Bus Width features such as 1 Core, 8/16-Bit, it has an Operating Temperature range of 0°C ~ 70°C (TA), as well as the 132-BEPGA Package Case, the device can also be used as Tray Packaging. In addition, the RAM Controllers is DRAM, the device is offered in M683xx Series, the device has a 25MHz of Speed, and Supplier Device Package is 132-PGA (34.5x34.5), and the Voltage I O is 5.0V.

Features

M683xx Series
EC000 Core

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MC68306AG16B Microprocessor applications.

  • Measurement and control field
  • Automatic control
  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
产品属性
全选
型号系列: M683xx
包装: 托盘
部件状态: 停产
核心处理器: EC000
每总线宽度内核数: 1 核,32 位
速度: 16MHz
RAM 控制器: DRAM
图形加速: 无
输入/输出电压: 5.0V
工作温度: 0°C ~ 70°C(TA)
安装类型: 表面贴装型
封装/外壳: 144-LQFP
供应商器件封装: 144-LQFP(20x20)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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