
NXP MC33MR2001V2VK
77GHz
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价格更新:一个月前博斯克质量保证







Overview
MC33HB2001EKR2 with pin details, that includes Tape & Reel (TR) Alternate Packaging Packaging, they are designed to operate with a 32-SSOP (0.295", 7.50mm Width) Exposed Pad Package Case, Technology is shown on datasheet note for use in a Power MOSFET, it has an Operating Temperature range of -40°C ~ 150°C (TJ), Mounting Type is designed to work in Surface Mount, as well as the Slew Rate Controlled Features, the device can also be used as DC Motors, General Purpose Applications. In addition, the Interface is SPI, the device is offered in 5 V ~ 28 V Voltage Supply, the device has a 32-SOIC Exposed Pad of Supplier Device Package, and Fault Protection is Over Temperature, Over Voltage, UVLO, and the Output Configuration is Half Bridge (2), and Load Type is Inductive, and the Rds On Typ is 125 mOhm LS (Max), 125 mOhm HS (Max), and Voltage Load is 5 V ~ 28 V.
MC33HB2001FK with EDA / CAD Models, that includes Tray Alternate Packaging Packaging, they are designed to operate with a Surface Mount Mounting Type, Interface is shown on datasheet note for use in a SPI, that offers Features features such as Slew Rate Controlled, Technology is designed to work in Power MOSFET, as well as the Over Temperature, Over Voltage, UVLO Fault Protection, the device can also be used as Inductive Load Type. In addition, the Output Configuration is Half Bridge (2), the device is offered in DC Motors, General Purpose Applications, the device has a 5 V ~ 28 V of Voltage Supply, and Voltage Load is 5 V ~ 28 V, it has an Operating Temperature range of -40°C ~ 150°C (TJ), and Supplier Device Package is 32-PQFN (8x8), and the Package Case is 32-PowerQFN, and Rds On Typ is 125 mOhm LS (Max), 125 mOhm HS (Max).
Features
Tray Package77GHz Frequency - Center
0.236" L x 0.236" W (6.00mm x 6.00mm) Size / Dimension
0.040" (1.02mm) Height
- 起步价为$40,南非、巴西、印度、巴基斯坦、以色列等国家的价格会有所变动,详情请咨询相关客服人员。
- 包裹重量≤0.5kg的基本运费根据时区和国家而定。
- 我们的产品目前使用DHL,顺丰和UPS运输。如果数量少,则选择联邦快递。
- 一旦发货,预期交货时间跟选择的运输方式有所变动。
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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博斯克服务全球105个国家的客户。
配件发货: 25M+
我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。
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